2012-06-26

Dow Corning and Suss cooperate on making 3-D TSV chips

Dow Corning and Suss cooperate on making 3-D TSV chips

MANHASSET, NY -- Dow Corning and SUSS MicroTec are collaborating on developing a material and equipment system solution for high volume manufacturing of 3-D TSV packaged devices.

Stacking two or more chips vertically using thru-silicon via technology is one of the viable ways to reduce the IC footprint, though it requires the industry to find a solution for handling thin wafers, using temporary bonding.

Comprised of both an adhesive and release layer, the Dow Corning silicon-based material is optimized for simple processing with a bi-layer spin coating and bonding process.

Combined with SUSS MicroTec equipment, the total solution offers the benefits of simple bonding using standard manufacturing methods, provides compatibility with thermal and chemical requirements for via middle and interposer TSV processing, as well as faster room temperature de-bonding required for advanced packaging applications.

Dow Corning (Midland, MI) builds on a long history of silicon-based innovation and collaboration in semiconductor packaging. Dow Corning is equally owned by The Dow Chemical Company and Corning, Inc, serving the diverse needs of more than 25,000 customers worldwide. SUSS MicroTec AG (Garching, Germany) is a supplier of equipment and process solutions for microstructuring in the semiconductor industry and related markets.
TAG:3 D TSVs Process Equipment

Dow Corning and Suss cooperate on making 3-D TSV chips

Dow Corning and Suss cooperate on making 3-D TSV chips

MANHASSET, NY -- Dow Corning and SUSS MicroTec are collaborating on developing a material and equipment system solution for high volume manufacturing of 3-D TSV packaged devices.

Stacking two or more chips vertically using thru-silicon via technology is one of the viable ways to reduce the IC footprint, though it requires the industry to find a solution for handling thin wafers, using temporary bonding.

Comprised of both an adhesive and release layer, the Dow Corning silicon-based material is optimized for simple processing with a bi-layer spin coating and bonding process.

Combined with SUSS MicroTec equipment, the total solution offers the benefits of simple bonding using standard manufacturing methods, provides compatibility with thermal and chemical requirements for via middle and interposer TSV processing, as well as faster room temperature de-bonding required for advanced packaging applications.

Dow Corning (Midland, MI) builds on a long history of silicon-based innovation and collaboration in semiconductor packaging. Dow Corning is equally owned by The Dow Chemical Company and Corning, Inc, serving the diverse needs of more than 25,000 customers worldwide. SUSS MicroTec AG (Garching, Germany) is a supplier of equipment and process solutions for microstructuring in the semiconductor industry and related markets.
TAG:3 D TSVs Process Equipment

ST starts sampling STM32 F3 microcontroller range

ST starts sampling STM32 F3 microcontroller range


LONDON – STMicroelectronics NV (Geneva, Switzerland) has announced it has started delivering samples of its STM32 F3 series of microcontrollers which include a variety of analog peripherals and DSP capability.

STM32 F3 series MCUs are system-on-chip devices based on the Cortex-M4 core with FPU licensed from ARM Holdings plc, and are optimized for efficient handling and processing of mixed signals in circuits such as three-phase motor controls, biometrics and industrial sensor outputs or audio filters.

The F3 series includes 70 different chip designs and sits between the STM32 F1 range, based on the Cortex-M3 core, and the high performance STM32 F4 range, based on the Cortex-M4 plus FPU cores together with large embedded memory and clock frequencies up to 168-MHz.

With the addition of F3 microcontrollers, ST's STM32 family now offers more than 350 variants, ST said. The F3 series combines analog peripherals and DSP capability.

Peripherals include a 12-bit analog-to-digital converter (ADC) with 5-Msamples per second performance or up to three 16-bit sigma-delta ADCs on chip.

Prices for the STM32F3 devices start from about $2.24 for 1,000 unit quantities with lower prices for higher quantities. Devices are sampling now and are scheduled to enter full production in 3Q12.


Related links and articles:


www.st.com

News articles:

Why TI does MCU designs in Shanghai

Nanoampere MCU is designed to serve sensors

Renesas extends MCU work with TSMC to 40-nm



TAG:STMicroelectronics STM32 MCU microcontroller semiconductor

ST starts sampling STM32 F3 microcontroller range

ST starts sampling STM32 F3 microcontroller range


LONDON – STMicroelectronics NV (Geneva, Switzerland) has announced it has started delivering samples of its STM32 F3 series of microcontrollers which include a variety of analog peripherals and DSP capability.

STM32 F3 series MCUs are system-on-chip devices based on the Cortex-M4 core with FPU licensed from ARM Holdings plc, and are optimized for efficient handling and processing of mixed signals in circuits such as three-phase motor controls, biometrics and industrial sensor outputs or audio filters.

The F3 series includes 70 different chip designs and sits between the STM32 F1 range, based on the Cortex-M3 core, and the high performance STM32 F4 range, based on the Cortex-M4 plus FPU cores together with large embedded memory and clock frequencies up to 168-MHz.

With the addition of F3 microcontrollers, ST's STM32 family now offers more than 350 variants, ST said. The F3 series combines analog peripherals and DSP capability.

Peripherals include a 12-bit analog-to-digital converter (ADC) with 5-Msamples per second performance or up to three 16-bit sigma-delta ADCs on chip.

Prices for the STM32F3 devices start from about $2.24 for 1,000 unit quantities with lower prices for higher quantities. Devices are sampling now and are scheduled to enter full production in 3Q12.


Related links and articles:


www.st.com

News articles:

Why TI does MCU designs in Shanghai

Nanoampere MCU is designed to serve sensors

Renesas extends MCU work with TSMC to 40-nm



TAG:STMicroelectronics STM32 MCU microcontroller semiconductor

Virtual jobs fair offers engineers work in Singapore

Virtual jobs fair offers engineers work in Singapore


LONDON – Engineers with experience in the consumer electronics and semiconductor sectors and who are prepared to continue their careers in Singapore could benefit from the first ever online recruitment event being organized by Contact Singapore.

The event takes place online between August 20 to August 22 and registered attendees will be able to chat with managers and recruitment representatives from companies in Singapore including: Broadcom, Infineon Technologies, Intel, Lantiq and Micron Technology.

Contact Singapore, an alliance between the Singapore Economic Development Board and city state's Ministry of Manpower, is an agency set up to try and draw overseas Singaporeans back and to encourage talented professionals to come and work there.

"Electronics is the bedrock of Singapore's manufacturing activities, contributing 30 percent to the nation’s manufacturing output," the organizers said. "We are looking out for top engineering talent to advance technology and innovation in Singapore," it added.

Registration for the event can be found at: www.contactsingapore.sg/electronicsVCF2012

Information on working and living in Singapore can be found at: www.contactsingapore.com


Related links and articles:


Singapore plans fabless chip firm haven

UMC, Singapore's IME team on TSV process for image sensors

InvenSense names Globalfoundries, TMSC as dual-source MEMS makers

Move Infineon to Asia? Who said that?

Infineon to spend $350 million in Singapore

TAG:Contact Singapore Singapore jobs fair online consumer electronics semiconductor

Virtual jobs fair offers engineers work in Singapore

Virtual jobs fair offers engineers work in Singapore


LONDON – Engineers with experience in the consumer electronics and semiconductor sectors and who are prepared to continue their careers in Singapore could benefit from the first ever online recruitment event being organized by Contact Singapore.

The event takes place online between August 20 to August 22 and registered attendees will be able to chat with managers and recruitment representatives from companies in Singapore including: Broadcom, Infineon Technologies, Intel, Lantiq and Micron Technology.

Contact Singapore, an alliance between the Singapore Economic Development Board and city state's Ministry of Manpower, is an agency set up to try and draw overseas Singaporeans back and to encourage talented professionals to come and work there.

"Electronics is the bedrock of Singapore's manufacturing activities, contributing 30 percent to the nation’s manufacturing output," the organizers said. "We are looking out for top engineering talent to advance technology and innovation in Singapore," it added.

Registration for the event can be found at: www.contactsingapore.sg/electronicsVCF2012

Information on working and living in Singapore can be found at: www.contactsingapore.com


Related links and articles:


Singapore plans fabless chip firm haven

UMC, Singapore's IME team on TSV process for image sensors

InvenSense names Globalfoundries, TMSC as dual-source MEMS makers

Move Infineon to Asia? Who said that?

Infineon to spend $350 million in Singapore

TAG:Contact Singapore Singapore jobs fair online consumer electronics semiconductor

Dow Corning and Suss cooperate on making 3-D TSV

Dow Corning and Suss cooperate on making 3-D TSV

MANHASSET, NY -- Dow Corning and SUSS MicroTec are collaborating on developing a material and equipment system solution for high volume manufacturing of 3-D TSV packaged devices.

Stacking two or more chips vertically using thru-silicon via technology is one of the viable ways to reduce the IC footprint, though it requires the industry to find a solution for handling thin wafers, using temporary bonding.

Comprised of both an adhesive and release layer, the Dow Corning silicon-based material is optimized for simple processing with a bi-layer spin coating and bonding process.

Combined with SUSS MicroTec equipment, the total solution offers the benefits of simple bonding using standard manufacturing methods, provides compatibility with thermal and chemical requirements for via middle and interposer TSV processing, as well as faster room temperature de-bonding required for advanced packaging applications.

Dow Corning (Midland, MI) builds on a long history of silicon-based innovation and collaboration in semiconductor packaging. Dow Corning is equally owned by The Dow Chemical Company and Corning, Inc, serving the diverse needs of more than 25,000 customers worldwide. SUSS MicroTec AG (Garching, Germany) is a supplier of equipment and process solutions for microstructuring in the semiconductor industry and related markets.
TAG:3 D TSVs Process Equipment

Dow Corning and Suss cooperate on making 3-D TSV

Dow Corning and Suss cooperate on making 3-D TSV

MANHASSET, NY -- Dow Corning and SUSS MicroTec are collaborating on developing a material and equipment system solution for high volume manufacturing of 3-D TSV packaged devices.

Stacking two or more chips vertically using thru-silicon via technology is one of the viable ways to reduce the IC footprint, though it requires the industry to find a solution for handling thin wafers, using temporary bonding.

Comprised of both an adhesive and release layer, the Dow Corning silicon-based material is optimized for simple processing with a bi-layer spin coating and bonding process.

Combined with SUSS MicroTec equipment, the total solution offers the benefits of simple bonding using standard manufacturing methods, provides compatibility with thermal and chemical requirements for via middle and interposer TSV processing, as well as faster room temperature de-bonding required for advanced packaging applications.

Dow Corning (Midland, MI) builds on a long history of silicon-based innovation and collaboration in semiconductor packaging. Dow Corning is equally owned by The Dow Chemical Company and Corning, Inc, serving the diverse needs of more than 25,000 customers worldwide. SUSS MicroTec AG (Garching, Germany) is a supplier of equipment and process solutions for microstructuring in the semiconductor industry and related markets.
TAG:3 D TSVs Process Equipment

Imec, Murata team on reconfigurable radio IC design

Imec, Murata team on reconfigurable radio IC design

PARIS – Next generation wireless access asks for reconfigurable radios. Imec and Murata Manufacturing Co. Ltd. said they have sealed a three-year R&D collaboration to work on cognitive reconfigurable radio front-end.

Through the collaboration, Murata said it expects to better apprehend the technology and design challenges for next-generation reconfigurable radios. Murata and Imec said they intend to assess the impact on antenna interface components and identify new opportunities for next generation front-end modules.

“By combining fundamental rethinking of the circuit architectures and designs, and clever use of the benefits of deeply scaled digital CMOS technologies, we aim to develop reconfigurable radio transceivers competitive in terms of area, cost, performance and power consumption,” declared Liesbet Van der Perre, director of the green radio programs, in a statement. “The transceivers will cover all key broadband communication standards including LTE and LTE advanced, digital broadcasting and next-generation WiFi (802.11n/ac).”

Earlier this year, HiSilicon joined imec’s R&D program on cognitive reconfigurable radio to jointly conceive low-power and compact high-performance reconfigurable RF transceivers leveraging on state-of-the-art CMOS technology. The objective of the collaboration agreement was to develop innovative RF transceiver architectures for next-generation mobile terminals.

Imec said its reconfigurable radio front-end, named SCALDIO (scalable radio), is programmable to operate with all current and future cellular, wireless local area network (WLAN), wireless personal area network (WPAN), broadcast and positioning standards in the frequency range between 174MHz and 6GHz.

Imec has 2 generations of SCALDIO radio transceivers with proven silicon performance: SCALDIO-1 and SCALDIO-2. SCALDIO-2 has been realized in a digital SoC 40nm CMOS technology.
TAG:Imec Murata Reconfigurable Radio Front End Components

Imec, Murata team on reconfigurable radio IC design

Imec, Murata team on reconfigurable radio IC design

PARIS – Next generation wireless access asks for reconfigurable radios. Imec and Murata Manufacturing Co. Ltd. said they have sealed a three-year R&D collaboration to work on cognitive reconfigurable radio front-end.

Through the collaboration, Murata said it expects to better apprehend the technology and design challenges for next-generation reconfigurable radios. Murata and Imec said they intend to assess the impact on antenna interface components and identify new opportunities for next generation front-end modules.

“By combining fundamental rethinking of the circuit architectures and designs, and clever use of the benefits of deeply scaled digital CMOS technologies, we aim to develop reconfigurable radio transceivers competitive in terms of area, cost, performance and power consumption,” declared Liesbet Van der Perre, director of the green radio programs, in a statement. “The transceivers will cover all key broadband communication standards including LTE and LTE advanced, digital broadcasting and next-generation WiFi (802.11n/ac).”

Earlier this year, HiSilicon joined imec’s R&D program on cognitive reconfigurable radio to jointly conceive low-power and compact high-performance reconfigurable RF transceivers leveraging on state-of-the-art CMOS technology. The objective of the collaboration agreement was to develop innovative RF transceiver architectures for next-generation mobile terminals.

Imec said its reconfigurable radio front-end, named SCALDIO (scalable radio), is programmable to operate with all current and future cellular, wireless local area network (WLAN), wireless personal area network (WPAN), broadcast and positioning standards in the frequency range between 174MHz and 6GHz.

Imec has 2 generations of SCALDIO radio transceivers with proven silicon performance: SCALDIO-1 and SCALDIO-2. SCALDIO-2 has been realized in a digital SoC 40nm CMOS technology.
TAG:Imec Murata Reconfigurable Radio Front End Components

Dow Corning, SUSS MicroTec team on TSV chip packaging

Dow Corning, SUSS MicroTec team on TSV chip packaging

SAN FRANCISCO—Materials vendor Dow Corning Corp. and semiconductor manufacturing equipment vendor SUSS MicroTec AG said Monday (June 25) they would collaborate on a temporary bonding solution for 3-D through-silicon via (TSV) semiconductor packaging.

As part of this non-exclusive agreement, the companies are developing a material and equipment system solution for high volume manufacturing of 3-D TSV packaged devices, the companies said.

The Dow Corning silicon-based material—comprised of both an adhesive and release layer—is optimized for simple processing with a bi-layer spin coating and bonding process, the companies. Combined with SUSS MicroTec equipment, the solution offers the benefits of simple bonding using standard manufacturing methods and provides compatibility with thermal and chemical requirements for via middle and interposer TSV processing, as well as faster room temperature de-bonding required for advanced packaging applications, the companies said.

"Working side by side with Dow Corning expedited process development and this experience will facilitate faster implementation for customers interested in using the Dow Corning and SUSS MicroTec temporary bonding materials and equipment," said Frank Averdung, president and CEO of SUSS MicroTec, in a statement.
TAG:Suss Microtec Dow Corning TSV Packaging

White knight or asset stripper?

White knight or asset stripper?


Reports are coming out of Japan that private equity company Kohlberg Kravis Roberts & Co. (KKR) LP is being asked to invest in struggling Japanese chip company Renesas Electronics Corp. to help it raise more than $1 billion for use executing a major restructuring that could see Renesas cut 30 percent of its workforce.

Renesas Electronics has made losses since it was formed as a merger of the semiconductor interests of NEC and Renesas Technology in 2010. It can be argued that a radical restructuring of the large chipmaker is overdue. Renesas Technology was itself the merger of the chip making interests of Hitachi Ltd. and Mitsubishi Electric. Indeed it can be argued that chip companies in the United States and Europe have already been through their necessary restructuring.

But while Renesas may have been slow to change it has had other challenges to cope with. In the last few years Renesas has endured both physical and financial disasters. The economic bust of 2008-2009, which continues to reverberate globally, was followed by the Great Eastern Japan earthquake and tsunami.

Which leaves the question: is KKR a knight in shining armor riding to the rescue of Renesas? Or is it an asset stripper that will insist that the company is broken up and sold off leaving Japan's national semiconductor champion as a hollow, non-manufacturing shell of the company it could have been?

KKR's has previous form. It was a member of a consortium that paid 6.4 billion euro (about $8 billion) for an 80 percent stake in chip company NXP as it was spun out of Koninklijke Philips Electronics NV (Amsterdam, The Netherlands) in 2006. KKR also put a consortium together to bid for the spin-off of Freescale from its parent Motorola in 2006 but missed out to a consortium led by another private equity firm Blackstone.

The deal KKR did over NXP was not quite the same as appears to be in prospect for Renesas. In the case of NXP, the private equity had a clear majority stake and could dictate terms and how any proceeds of sell offs were used; which was mainly to repay the debt that NXP incurred as part of the original deal. In the Renesas case, as the potential deal has been reported, KKR would receive a leading but minority stake in Renesas.

How you view the prospect of KKR backing Renesas may depend on what sort of job you think they have done supporting NXP.

But now the companies and the banks have little money or appetite to back chip companies it may be that private equity capital is the only way to go. And in such times as these, cash is king and can dictate terms.


Related links and articles:

Renesas seeks $620 million from KKR, says report

Report: Renesas Mobile up for sale in re-org

Report: Renesas closes in on cash for cuts

TAG:private equity Renesas KKR semiconductor

Rambus names Ronald Black CEO

Rambus names Ronald Black CEO

SAN FRANCISCO—Technology licensor Rambus Inc. Monday (June 25) named Ronald Black, a 20-year veteran of the semiconductor and mobile industries, to the position of CEO. Black replaces Howard Hughes, Rambus' CEO since 2005, who announced earlier this year that he planned to retire.

Black is the former CEO of French handset vendor MobiWire SAS, formerly known as Sagem Wireless. Black also served as CEO of UPEK Inc., which was acquired by AuthenTec Inc. in 2010, and Wavecom SA, a provider of embedded wireless technologies for machine-to-machine communications. Prior to that, Black served as executive vice president of the client systems group at Agere Systems and, previously, held senior executive positions at several firms, including Motorola and IBM Microelectronics.

"Ron's experience in managing through complex businesses at various levels and helping them achieve objectives make him an excellent fit for the next phase of Rambus," said J. Thomas Bentley, chairman of Rambus' board of directors, in a statement.

"Rambus has a long history of strong technology development with some of the world’s best inventors solving some very tough problems." Black said. "There are tremendous opportunities ahead in the lighting and security businesses as well as in the traditional semiconductor business."

Hughes will remain on Rambus' board of directors.


TAG:Ronald Black Harold Hughes Rambus

Rambus names Ronald Black CEO

Rambus names Ronald Black CEO

SAN FRANCISCO—Technology licensor Rambus Inc. Monday (June 25) named Ronald Black, a 20-year veteran of the semiconductor and mobile industries, to the position of CEO. Black replaces Howard Hughes, Rambus' CEO since 2005, who announced earlier this year that he planned to retire.

Black is the former CEO of French handset vendor MobiWire SAS, formerly known as Sagem Wireless. Black also served as CEO of UPEK Inc., which was acquired by AuthenTec Inc. in 2010, and Wavecom SA, a provider of embedded wireless technologies for machine-to-machine communications. Prior to that, Black served as executive vice president of the client systems group at Agere Systems and, previously, held senior executive positions at several firms, including Motorola and IBM Microelectronics.

"Ron's experience in managing through complex businesses at various levels and helping them achieve objectives make him an excellent fit for the next phase of Rambus," said J. Thomas Bentley, chairman of Rambus' board of directors, in a statement.

"Rambus has a long history of strong technology development with some of the world’s best inventors solving some very tough problems." Black said. "There are tremendous opportunities ahead in the lighting and security businesses as well as in the traditional semiconductor business."

Hughes will remain on Rambus' board of directors.


TAG:Ronald Black Harold Hughes Rambus

White knight or asset stripper?

White knight or asset stripper?


Reports are coming out of Japan that private equity company Kohlberg Kravis Roberts & Co. (KKR) LP is being asked to invest in struggling Japanese chip company Renesas Electronics Corp. to help it raise more than $1 billion for use executing a major restructuring that could see Renesas cut 30 percent of its workforce.

Renesas Electronics has made losses since it was formed as a merger of the semiconductor interests of NEC and Renesas Technology in 2010. It can be argued that a radical restructuring of the large chipmaker is overdue. Renesas Technology was itself the merger of the chip making interests of Hitachi Ltd. and Mitsubishi Electric. Indeed it can be argued that chip companies in the United States and Europe have already been through their necessary restructuring.

But while Renesas may have been slow to change it has had other challenges to cope with. In the last few years Renesas has endured both physical and financial disasters. The economic bust of 2008-2009, which continues to reverberate globally, was followed by the Great Eastern Japan earthquake and tsunami.

Which leaves the question: is KKR a knight in shining armor riding to the rescue of Renesas? Or is it an asset stripper that will insist that the company is broken up and sold off leaving Japan's national semiconductor champion as a hollow, non-manufacturing shell of the company it could have been?

KKR's has previous form. It was a member of a consortium that paid 6.4 billion euro (about $8 billion) for an 80 percent stake in chip company NXP as it was spun out of Koninklijke Philips Electronics NV (Amsterdam, The Netherlands) in 2006. KKR also put a consortium together to bid for the spin-off of Freescale from its parent Motorola in 2006 but missed out to a consortium led by another private equity firm Blackstone.

The deal KKR did over NXP was not quite the same as appears to be in prospect for Renesas. In the case of NXP, the private equity had a clear majority stake and could dictate terms and how any proceeds of sell offs were used; which was mainly to repay the debt that NXP incurred as part of the original deal. In the Renesas case, as the potential deal has been reported, KKR would receive a leading but minority stake in Renesas.

How you view the prospect of KKR backing Renesas may depend on what sort of job you think they have done supporting NXP.

But now the companies and the banks have little money or appetite to back chip companies it may be that private equity capital is the only way to go. And in such times as these, cash is king and can dictate terms.


Related links and articles:

Renesas seeks $620 million from KKR, says report

Report: Renesas Mobile up for sale in re-org

Report: Renesas closes in on cash for cuts

TAG:private equity Renesas KKR semiconductor

Video: '7 minutes of terror' for next Mars probe

Video: '7 minutes of terror' for next Mars probe


WASHINGTON – On Aug. 5, 2012, after completing a nine-month, 354 million mile journey, mission controllers at NASA’s Jet Propulsion Laboratory will attempt to break the fall of a rover-carrying spacecraft traveling at about 13,000 miles per hour to zero and land in a Martian crater.

The landing sequence for the Mars rover Curiosity is called the “Seven Minutes of Terror.”

For the first time, NASA will use an untried descent and landing technique to lower Curiosity to the surface near Gale Crater using a sky crane. The entire landing sequence will be controlled by computers relying about 500,000 lines of code that will control no less than 76 rockets and thrusters.Mission managers won’t know whether it worked for 14 minutes, the time it takes a signal from Mars to travel back to Earth.

To the casual observer, using a sky crane to land on Mars may look crazy, but “it is the result of reasoned engineering thought,” argues JPL’s Adam Steltzner, chief engineer for the Mars Science Laboratory.

“If any one thing doesn’t work just right, it’s game over,” adds JPL’s Tom Rivellini.

Previous Martian landings used what amounted to air bags to break the fall of rovers. Curiosity is too big and heavy – about the size of an SUV – to use that landing method. Hence, JPL engineers came up with a system of breaking rockets, a huge parachute and the sky crane to slow Curiosity’s fiery entry into the faint Martian atmosphere and gently deposit it in Gale Crater, which is suspected of harboring signs of Martian life.

The JPL engineers and scientists are sticking their necks way out on this mission, and that’s precisely the type of technological risk-taking that is needed to explore the solar system with our marvelous machines.


TAG:Mars Science Laboratory Jet Propulsion Laboratory Mars Rover Sky Crane Curiosity Mars

Intel may see $2B growth beyond PCs in 2013

Intel may see $2B growth beyond PCs in 2013

SAN JOSE – Next year, Intel is poised to generate $2 billion in revenues—half its expected revenue growth—from chips outside its traditional PC x86 processors, according to a financial analyst who tracks the company.

With its relatively new embedded, NAND flash and wireless products, “Intel has dramatically outperformed its competition on revenue growth and/or profitability from 2008-2012 and is poised to extend these gains in 2013,” said Ross Seymore, an analyst with Deutsche Bank Equity Research.

“These segments have the potential to generate about 50 percent of the $4 billion revenue growth implied in our 2013 estimates, leaving us more confident in upside potential and Intel's share price,” said Seymore who continues to rate Intel’s stock as a buy.

Specifically, Seymore said revenue for Intel’s Intelligent Systems Group has nearly doubled over the last five years and is poised to top $2 billion in 2012. Its NAND Solution Group revenue has tripled since 2008, and enjoys the best margins in the NAND industry by focusing on high value segments. Intel’s wireless group, still in an early stage, is already a $2 billion business, and the company believes it can grow more than 50 percent in 2013, the analyst said.

The development is arguably a historic milestone for the company. Intel has tried for years to expand beyond the PC market with little success to date. During the dot-com boom in acquired a handful of communications chip companies and even started a data center business, but had to jettison nearly all its plans after the market turned sour.

Intel is not without its risks. The company could see slower than expected PC unit growth, face market share losses to AMD, or see selling prices decline, he noted.
TAG:Intel X86 Processors CPUs PCs NAND Flash Embedded Wireless

Intel may see $2B growth beyond PCs in 2013

Intel may see $2B growth beyond PCs in 2013

SAN JOSE – Next year, Intel is poised to generate $2 billion in revenues—half its expected revenue growth—from chips outside its traditional PC x86 processors, according to a financial analyst who tracks the company.

With its relatively new embedded, NAND flash and wireless products, “Intel has dramatically outperformed its competition on revenue growth and/or profitability from 2008-2012 and is poised to extend these gains in 2013,” said Ross Seymore, an analyst with Deutsche Bank Equity Research.

“These segments have the potential to generate about 50 percent of the $4 billion revenue growth implied in our 2013 estimates, leaving us more confident in upside potential and Intel's share price,” said Seymore who continues to rate Intel’s stock as a buy.

Specifically, Seymore said revenue for Intel’s Intelligent Systems Group has nearly doubled over the last five years and is poised to top $2 billion in 2012. Its NAND Solution Group revenue has tripled since 2008, and enjoys the best margins in the NAND industry by focusing on high value segments. Intel’s wireless group, still in an early stage, is already a $2 billion business, and the company believes it can grow more than 50 percent in 2013, the analyst said.

The development is arguably a historic milestone for the company. Intel has tried for years to expand beyond the PC market with little success to date. During the dot-com boom in acquired a handful of communications chip companies and even started a data center business, but had to jettison nearly all its plans after the market turned sour.

Intel is not without its risks. The company could see slower than expected PC unit growth, face market share losses to AMD, or see selling prices decline, he noted.
TAG:Intel X86 Processors CPUs PCs NAND Flash Embedded Wireless

Renesas seeks $620 million from KKR, says report

Renesas seeks $620 million from KKR, says report


LONDON – Struggling Japanese chip company Renesas Electronics Corp. is to seek a 50 billion yen (about $620 million) investment from private equity firm Kohlberg Kravis Roberts & Co. (KKR), according to a Nikkei report.

The 50 billion yen represents about the amount that Renesas needs for a $1.3 billion cash injection for a plan to lay off about one-third its work force and to close more than half its domestic manufacturing sites.

Two of Renesas' three parent companies – Hitachi and Mitsubishi – have agreed in principle to provide a support package worth 50 billion yen. NEC, the third and largest shareholder in Renesas, is unable to contribute with loans as it is struggling with the implementation of its own turn-around plan, according to an earlier Reuters, report.

A contribution of 50 billion yen would increase Renesas outstanding share count by nearly 40 percent, giving KKR a stake of just over 26 percent, according reports. It would also make KKR the largest shareholder in Renesas, ahead of NEC, Hitachi and Mitsubishi, whose shareholdings of about 35, 31 and 25 percent, respectively would be diluted to about 25, 22 and 18 percent, respectively. It is not expected that Hitachi and Mitsubishi would increase their stakes in Renesas.

KKR was part of a consortium that paid 6.4 billion euro (about $8 billion) for an 80 percent stake in chip company NXP as it was spun out of Koninklijke Philips Electronics NV (Amsterdam, The Netherlands) in 2006. NXP loaded with debt to pay for the money used to buy it out. In 2009 the private equity holding was written down to just 10 percent of its original value.


Related links and articles:


Report: Renesas closes in on cash for cuts

Report: Renesas Mobile up for sale in re-org

Renesas, TSMC tout licensable MCU platform using 40-nm eFlash

TAG:private equity Renesas KKR semiconductor

Renesas seeks $620 million from KKR, says report

Renesas seeks $620 million from KKR, says report


LONDON – Struggling Japanese chip company Renesas Electronics Corp. is to seek a 50 billion yen (about $620 million) investment from private equity firm Kohlberg Kravis Roberts & Co. (KKR), according to a Nikkei report.

The 50 billion yen represents about the amount that Renesas needs for a $1.3 billion cash injection for a plan to lay off about one-third its work force and to close more than half its domestic manufacturing sites.

Two of Renesas' three parent companies – Hitachi and Mitsubishi – have agreed in principle to provide a support package worth 50 billion yen. NEC, the third and largest shareholder in Renesas, is unable to contribute with loans as it is struggling with the implementation of its own turn-around plan, according to an earlier Reuters, report.

A contribution of 50 billion yen would increase Renesas outstanding share count by nearly 40 percent, giving KKR a stake of just over 26 percent, according reports. It would also make KKR the largest shareholder in Renesas, ahead of NEC, Hitachi and Mitsubishi, whose shareholdings of about 35, 31 and 25 percent, respectively would be diluted to about 25, 22 and 18 percent, respectively. It is not expected that Hitachi and Mitsubishi would increase their stakes in Renesas.

KKR was part of a consortium that paid 6.4 billion euro (about $8 billion) for an 80 percent stake in chip company NXP as it was spun out of Koninklijke Philips Electronics NV (Amsterdam, The Netherlands) in 2006. NXP loaded with debt to pay for the money used to buy it out. In 2009 the private equity holding was written down to just 10 percent of its original value.


Related links and articles:


Report: Renesas closes in on cash for cuts

Report: Renesas Mobile up for sale in re-org

Renesas, TSMC tout licensable MCU platform using 40-nm eFlash

TAG:private equity Renesas KKR semiconductor

2012-06-25

Sony, Panasonic join hands to print OLED displays

Sony, Panasonic join hands to print OLED displays


LONDON – Japanese consumer electronics giants Sony Corp. and Panasonic Corp. have announced they will collaborate in the development of organic light emitting diode (OLED) panels and modules for TVs and large-sized displays.

A well as working together on next-generation technology that would allow printing of high-resolution OLED panels and modules the two companies plan to study the possibility of collaboration in mass production, Sony said. The two companies aim to finalize the mass production technology in 2013.

The announcement of the tie up comes soon after plans for Sony to take a stake of more than 10 percent in the scandal-hit optical company Olympus Corp.

Sony has been a key developer of OLED technologies including manufacturing technologies that combine deposition and printing methods and the use of flexible organic thin-film transistors to drive displays.

Panasonic is a leader in large-sized screens and has developed an "all-printing method" for OLED display production. The printed method of fabrication has the advantage of producing performance competitive large-sized displays at lower cost.

At the same time as working together on OLED display technology the two companies will each contiunue to develop and commercialize its own OLED televisions and large-sized displays.


Related links and articles:

www.sony.net

News articles:

Reports: Olympus-Sony partnership

Sony to spend $1-billion on CMOS sensor production

Imec, Panasonic R&D collaboration to include flexible electronics


TAG:Sony Panasonic print OLED displays TV television organic semiconductor

Patent snafus could delay new video codec

Patent snafus could delay new video codec

SAN JOSE – The H.265 High Efficiency Video Coding (HEVC) standard is about to be ratified, promising a new generation of higher resolution and more compact digital video products. The bad news is chip makers are afraid to design products using it.

Vendors may have filed as many as 500 patents relating to the H.265 HEVC technology. But so far just who owns what and how much they expect in royalties is unclear.

The current video codec, H.264, has been the basis of digital video products such as cameraphones and digital video recorders for eight years. Thanks to a patent pool created by the MPEG Licensing Authority, the royalty rate was a flat 25 cents per chip, capped at about $12 million per vendor.

“That’s 40 million chips, but for cellphone chip vendors, that’s not much volume,” said an executive at one chip company who asked to remain anonymous.

The MPEG LA claims it is working on a follow on. “We plan to begin facilitation of an H.265 patent pool this summer,” said an MPEG LA spokesman.

But chip vendors say the group is having trouble getting support for the new pool. The new standard has many new patent holders not involved in the prior pool including Mediatek, Qualcomm and Samsung who do not want to join the group but prefer collecting royalties on their own, said the semiconductor executive.

The scenario is already playing out in other areas. Via Licensing recently said it will have this fall a 20-company patent pool for Long Term Evolution, the dominant 4G cellular technology. However, big patent holders including Ericsson, Nokia and Qualcomm are said to not be participating in the pool.

Chip makers expect the H.265 HEVC standard could be ratified within two months. That would open the door for them to start taping out their chip designs—if the royalty situation is clear.

“HEVC has so many patent holders and some of them say they will not be part of the pool but want to collect royalties themselves,” said the chip exec. “If say 20 people all want to collect royalties it will kill the standard—we need a fixed cost, it cannot be variable,” he added.

“People hate paying MPEG LA, but they were the only ones to collect royalties on H.264, so at least the business model was simple and clean,” said the source.

H.265 HEVC is expected to offer 30 to 50 percent boosts in compression efficiency over today’s codecs, lowering the bit rate needed to support quality video transmissions. The technology could be a big enabler for a new generation of compact, wearable cameras. It will also enable a new generation of 4K resolution TVs and monitors.

Engineers envision wearable cameras the size of postage stamps. The lower bit rates of H.265 HEVC could enable such cameras more easily to send video wirelessly so their output could be monitored on remote smartphones or PCs and tablets via cloud services

Thus the standard is “very important for us, we will enable it as soon as possible,” said the chip exec. “I think 4K TVs and monitors are coming on strong, and will be a reality in two years,” he added.
TAG:H 265 EVC Patent Pools MPEG LA H 65 EVC Codecs Video Patents Pools Smartphones TVs Monitors

Patent snafus could delay new video codec

Patent snafus could delay new video codec

SAN JOSE – The H.265 High Efficiency Video Coding (HEVC) standard is about to be ratified, promising a new generation of higher resolution and more compact digital video products. The bad news is chip makers are afraid to design products using it.

Vendors may have filed as many as 500 patents relating to the H.265 HEVC technology. But so far just who owns what and how much they expect in royalties is unclear.

The current video codec, H.264, has been the basis of digital video products such as cameraphones and digital video recorders for eight years. Thanks to a patent pool created by the MPEG Licensing Authority, the royalty rate was a flat 25 cents per chip, capped at about $12 million per vendor.

“That’s 40 million chips, but for cellphone chip vendors, that’s not much volume,” said an executive at one chip company who asked to remain anonymous.

The MPEG LA claims it is working on a follow on. “We plan to begin facilitation of an H.265 patent pool this summer,” said an MPEG LA spokesman.

But chip vendors say the group is having trouble getting support for the new pool. The new standard has many new patent holders not involved in the prior pool including Mediatek, Qualcomm and Samsung who do not want to join the group but prefer collecting royalties on their own, said the semiconductor executive.

The scenario is already playing out in other areas. Via Licensing recently said it will have this fall a 20-company patent pool for Long Term Evolution, the dominant 4G cellular technology. However, big patent holders including Ericsson, Nokia and Qualcomm are said to not be participating in the pool.

Chip makers expect the H.265 HEVC standard could be ratified within two months. That would open the door for them to start taping out their chip designs—if the royalty situation is clear.

“HEVC has so many patent holders and some of them say they will not be part of the pool but want to collect royalties themselves,” said the chip exec. “If say 20 people all want to collect royalties it will kill the standard—we need a fixed cost, it cannot be variable,” he added.

“People hate paying MPEG LA, but they were the only ones to collect royalties on H.264, so at least the business model was simple and clean,” said the source.

H.265 HEVC is expected to offer 30 to 50 percent boosts in compression efficiency over today’s codecs, lowering the bit rate needed to support quality video transmissions. The technology could be a big enabler for a new generation of compact, wearable cameras. It will also enable a new generation of 4K resolution TVs and monitors.

Engineers envision wearable cameras the size of postage stamps. The lower bit rates of H.265 HEVC could enable such cameras more easily to send video wirelessly so their output could be monitored on remote smartphones or PCs and tablets via cloud services

Thus the standard is “very important for us, we will enable it as soon as possible,” said the chip exec. “I think 4K TVs and monitors are coming on strong, and will be a reality in two years,” he added.
TAG:H 265 EVC Patent Pools MPEG LA H 65 EVC Codecs Video Patents Pools Smartphones TVs Monitors

Research shows more strain can improve transistors

Research shows more strain can improve transistors


LONDON – Researchers from France and Switzerland have shown that much higher stresses than previously applied can improve the hole mobility in p-type silicon beyond what had previously been thought possible. The results could change the way chip companies seek to engineer transistors at the leading edge, one of the researchers claimed.

Chip manufacturers already use strain to improve the electron and hole mobility in n- and p-type transistors. The use of stress to produce higher performing devices had previously thought to have reached a limit and that the use of exotic materials such as compound semiconductor layers or carbon sheets would be the next step in improving transistor and IC performance.

Now the researchers – from the Ecole Polytechnique, CNRS, Institut d’Electronique, de Microe´lectronique et de Nanotechnologie and the University of Geneva – have shown p-type silicon can perform under much higher stress than previously thought possible.

While the conductance of n-type silicon saturates at about 45 percent of its zero-stress value, as expected, p-type material conductance increases above the predicted limit without any significant saturation even at 3-gigapascal's uniaxial saturation, the researchers reported.

Theoretical predictions had indicated that the performance gain to be had using this technique levels out at around 1-GPa of applied compressive stress. This is around the level which process engineers can currently produce when fabricating commercial strained-silicon devices. It is also a reason why further investment in the technology had not been considered worthwhile, at least until now.

In p-type wafers, no saturation of the mobility was observed up to 3-GPa, even though these unprecedented mechanical stresses are well above the predicted onset of mobility saturation in p-type silicon. This observation, explained using full band electronic structure calculations, suggests that further investment in strained-silicon technology is justifiable, the researcher said.

The research was reported in Physical Review Letters earlier this month


Related links and articles:

http://prl.aps.org/abstract/PRL/v108/i25/e256801

News articles:

Intel FinFETs vary, may need SOI for shrink, says GSS

SuVolta positions DDC as node life extender

Researchers integrate silicon, III-V

TAG:Research p type transistor semiconductor gigapascal research science

Research shows more strain can improve transistors

Research shows more strain can improve transistors


LONDON – Researchers from France and Switzerland have shown that much higher stresses than previously applied can improve the hole mobility in p-type silicon beyond what had previously been thought possible. The results could change the way chip companies seek to engineer transistors at the leading edge, one of the researchers claimed.

Chip manufacturers already use strain to improve the electron and hole mobility in n- and p-type transistors. The use of stress to produce higher performing devices had previously thought to have reached a limit and that the use of exotic materials such as compound semiconductor layers or carbon sheets would be the next step in improving transistor and IC performance.

Now the researchers – from the Ecole Polytechnique, CNRS, Institut d’Electronique, de Microe´lectronique et de Nanotechnologie and the University of Geneva – have shown p-type silicon can perform under much higher stress than previously thought possible.

While the conductance of n-type silicon saturates at about 45 percent of its zero-stress value, as expected, p-type material conductance increases above the predicted limit without any significant saturation even at 3-gigapascal's uniaxial saturation, the researchers reported.

Theoretical predictions had indicated that the performance gain to be had using this technique levels out at around 1-GPa of applied compressive stress. This is around the level which process engineers can currently produce when fabricating commercial strained-silicon devices. It is also a reason why further investment in the technology had not been considered worthwhile, at least until now.

In p-type wafers, no saturation of the mobility was observed up to 3-GPa, even though these unprecedented mechanical stresses are well above the predicted onset of mobility saturation in p-type silicon. This observation, explained using full band electronic structure calculations, suggests that further investment in strained-silicon technology is justifiable, the researcher said.

The research was reported in Physical Review Letters earlier this month


Related links and articles:

http://prl.aps.org/abstract/PRL/v108/i25/e256801

News articles:

Intel FinFETs vary, may need SOI for shrink, says GSS

SuVolta positions DDC as node life extender

Researchers integrate silicon, III-V

TAG:Research p type transistor semiconductor gigapascal research science

Former Movidius executive joins haptic startup as CEO

Former Movidius executive joins haptic startup as CEO

Title-1

LONDON – Paul Costigan has become CEO of Senseg Oy (Espoo, Finland), a startup company that has developed touch interface technology that generates the feeling of virtual buttons on smooth surfaces. The technology has potential in smartphones, tablet computers and many other consumer and industrial applications.

The company, founded in 2006, is backed by Ambient Sound Investments, the investment vehicle of the founders of Skype. Senseg's technology creates a sensation of touch and texture using an electrostatic field to stimulate the fingers when they are close to or in contact with a display surface. By modulating this attractive force on the fingers a variety of sensations can be generated, including textured surfaces, edges, vibrations and 'key' movements. The company’s patented technology produces tactile sensations with no mechanical vibration and is set to be integrated into a new generation of touch interface devices including tablet computers.

Costigan, formerly COO with Movidius Ltd., will be based at Senseg's offices in Taipei, Taiwan and oversee the company's market entry.

Prior to his time with Movidius Costigan was COO at analog IP developer Chipidea Microelectronica SA and prior to that was co-founder and CEO of Massana a fabless chip company focused on gigabit Ethernet. Massana was acquired by Agere Systems, now part of LSI Corp., in 2003. Costigan began his career as a GSM chipset developer with Alcatel.

Costigan said the technology is working in prototype form and that the company is already working with a number of potential customers with a view to introducing the technology in volume in late 2013. "We're engaged with all the tier-ones," said Costigan. He added: "While the technology is fascinating I joined the company because of the strength of the sales pipeline."

The technology is applicable to all forms of mobile device including those based on Android and variants of Windows. "We are addressing Android initially, because it is so open an environment but we are pursuing all the major architectures," Costigan said.

The company has about 25 employees in three main locations in Cupertino, California, Taipei and Helsinki and has raised about 5 million euro (about $6 million) including Finnish government grants. Senseg is backed by Ambient Sound Investments, Vera Venture, and Veturi Venture Accelerator.


Related links and articles:

www.senseg.com

News articles:

Finnish interface developer gets Skype founders' venture capital

HiWave embeds haptic response in flat panels

Surround haptics extend tactile perception into simulation environments

TAG:Paul Costigan Movidius Skype Senseg Chipidea Massana semiconductor tixel haptic electrostatic

Former Movidius executive joins haptic startup as CEO

Former Movidius executive joins haptic startup as CEO

Title-1

LONDON – Paul Costigan has become CEO of Senseg Oy (Espoo, Finland), a startup company that has developed touch interface technology that generates the feeling of virtual buttons on smooth surfaces. The technology has potential in smartphones, tablet computers and many other consumer and industrial applications.

The company, founded in 2006, is backed by Ambient Sound Investments, the investment vehicle of the founders of Skype. Senseg's technology creates a sensation of touch and texture using an electrostatic field to stimulate the fingers when they are close to or in contact with a display surface. By modulating this attractive force on the fingers a variety of sensations can be generated, including textured surfaces, edges, vibrations and 'key' movements. The company’s patented technology produces tactile sensations with no mechanical vibration and is set to be integrated into a new generation of touch interface devices including tablet computers.

Costigan, formerly COO with Movidius Ltd., will be based at Senseg's offices in Taipei, Taiwan and oversee the company's market entry.

Prior to his time with Movidius Costigan was COO at analog IP developer Chipidea Microelectronica SA and prior to that was co-founder and CEO of Massana a fabless chip company focused on gigabit Ethernet. Massana was acquired by Agere Systems, now part of LSI Corp., in 2003. Costigan began his career as a GSM chipset developer with Alcatel.

Costigan said the technology is working in prototype form and that the company is already working with a number of potential customers with a view to introducing the technology in volume in late 2013. "We're engaged with all the tier-ones," said Costigan. He added: "While the technology is fascinating I joined the company because of the strength of the sales pipeline."

The technology is applicable to all forms of mobile device including those based on Android and variants of Windows. "We are addressing Android initially, because it is so open an environment but we are pursuing all the major architectures," Costigan said.

The company has about 25 employees in three main locations in Cupertino, California, Taipei and Helsinki and has raised about 5 million euro (about $6 million) including Finnish government grants. Senseg is backed by Ambient Sound Investments, Vera Venture, and Veturi Venture Accelerator.


Related links and articles:

www.senseg.com

News articles:

Finnish interface developer gets Skype founders' venture capital

HiWave embeds haptic response in flat panels

Surround haptics extend tactile perception into simulation environments

TAG:Paul Costigan Movidius Skype Senseg Chipidea Massana semiconductor tixel haptic electrostatic

Intel may see $2B non-x86 growth in 2013

Intel may see $2B non-x86 growth in 2013

SAN JOSE – Next year, Intel is poised to generate $2 billion in revenues—half its expected revenue growth—from chips outside its traditional x86 processors, according to a financial analyst who tracks the company.

With its relatively new embedded, NAND flash and wireless products, “Intel has dramatically outperformed its competition on revenue growth and/or profitability from 2008-2012 and is poised to extend these gains in 2013,” said Ross Seymore, an analyst with Deutsche Bank Equity Research.

“These segments have the potential to generate about 50 percent of the $4 billion revenue growth implied in our 2013 estimates, leaving us more confident in upside potential and Intel's share price,” said Seymore who continues to rate Intel’s stock as a buy.

Specifically, Seymore said revenue for Intel’s Intelligent Systems Group has nearly doubled over the last five years and is poised to top $2 billion in 2012. Its NAND Solution Group revenue has tripled since 2008, and enjoys the best margins in the NAND industry by focusing on high value segments. Intel’s wireless group, still in an early stage, is already a $2 billion business, and the company believes it can grow more than 50 percent in 2013, the analyst said.

The development is arguably a historic milestone for the company. Intel has tried for years to expand beyond the PC market with little success to date. During the dot-com boom in acquired a handful of communications chip companies and even started a data center business, but had to jettison nearly all its plans after the market turned sour.

Intel is not without its risks. The company could see slower than expected PC unit growth, face market share losses to AMD, or see selling prices decline, he noted.
TAG:Intel X86 Processors CPUs PCs NAND Flash Embedded Wireless

Intel may see $2B non-x86 growth in 2013

Intel may see $2B non-x86 growth in 2013

SAN JOSE – Next year, Intel is poised to generate $2 billion in revenues—half its expected revenue growth—from chips outside its traditional x86 processors, according to a financial analyst who tracks the company.

With its relatively new embedded, NAND flash and wireless products, “Intel has dramatically outperformed its competition on revenue growth and/or profitability from 2008-2012 and is poised to extend these gains in 2013,” said Ross Seymore, an analyst with Deutsche Bank Equity Research.

“These segments have the potential to generate about 50 percent of the $4 billion revenue growth implied in our 2013 estimates, leaving us more confident in upside potential and Intel's share price,” said Seymore who continues to rate Intel’s stock as a buy.

Specifically, Seymore said revenue for Intel’s Intelligent Systems Group has nearly doubled over the last five years and is poised to top $2 billion in 2012. Its NAND Solution Group revenue has tripled since 2008, and enjoys the best margins in the NAND industry by focusing on high value segments. Intel’s wireless group, still in an early stage, is already a $2 billion business, and the company believes it can grow more than 50 percent in 2013, the analyst said.

The development is arguably a historic milestone for the company. Intel has tried for years to expand beyond the PC market with little success to date. During the dot-com boom in acquired a handful of communications chip companies and even started a data center business, but had to jettison nearly all its plans after the market turned sour.

Intel is not without its risks. The company could see slower than expected PC unit growth, face market share losses to AMD, or see selling prices decline, he noted.
TAG:Intel X86 Processors CPUs PCs NAND Flash Embedded Wireless

2012-06-24

玉石圈钱骗局:女子损失230万

玉石圈钱骗局:女子损失230万

张某“送”给于先生的玉石 张某“送”给于先生的玉石

  本市四旬无业女子张某利用一些人对玉石知识了解不深又急于购买的心理圈了不少钱,市民楚女士就被圈走230万元,后来将张某告上法庭。一审支持了原告诉请后张某不服,上诉至市二中院。昨天,市二中院开庭审理了此案。

  天上掉馅饼

  借钱给她加工玉石

  免费供货给我开店

  楚女士40多岁,山东威海人,在天津经营海参生意多年,有一些积蓄。楚女士是珠宝玉石爱好者,通过别人介绍认识了张某。“当初,她说她是做玉石生意的,手头存有大量高档玉石。最初张某表现得很大方,一只镶金翡翠手镯强给我戴在手上,可不好往下摘,她就说这手镯和我有缘,送给我了。还说此前她妹妹要花10万元买她没给,让我对外就说花10万元买的。”楚女士非常不好意思地接受了张某的“贵重”礼物,后来对方向她借钱她也没好推却。

  借钱分了若干次,最后一次,张某对楚女士称,要借66万元去取加工好的玉石。“她说取来后免费为我供货,支持我开玉石店。我想,现在借钱给别人就可以开店,还是我喜欢的珠宝玉石店,这是件好事。”楚女士提出,她不懂玉石,张某表示可以免费培训。

  当时,楚女士觉得自己碰上了天大的好事。一来二去,手里有了张某给她出具的230万元借条。这些钱约定的最后还款期限是2011年10月,连本带利一并归还。但是,还款期限过去很长时间,任楚女士怎么催促,张某就是不还钱。

  发觉上当了

  送我的玉石不值钱

  230万债务不承认

  楚女士感觉上当后,才想到拿张某卖给她或送给她的那些玉石找专业人士咨询。“专家说,这些玉石都很平常,不值几个钱,而那只金镶玉的手镯,很多人都问我,它是不是断了,我才知道好的玉石手镯是不镶金的,只有断了或有问题的才会镶。”楚女士调查得知,张某没有财产,房子也是租的。

  今年2月,楚女士将张某告上法庭。滨海新区法院一审认定借款事实成立,判令张某返还楚女士230万元,并按银行同期贷款利率4倍偿还借款利息。张某不服,提出上诉称,她借过楚女士的钱,但没那么多,此外“我在她那里有价值200万元的玉石、翡翠,可用这些玉石优先偿还,剩下的才是债务”。

  昨天,市二中院开庭审理了此案。鉴于张某不承认一审认定的借款数额,二中院组织当事双方举证质证。近期,该院还将对此案开庭审理。

  给您提个醒

  “玉石圈钱”维权难

  了解前别盲目消费

  据介绍,像楚女士这样遭遇的人不止一个。一位下岗女工轻信可以免费开玉石店的谎言,借给张某数十万元,把自己的积蓄都搭了进去。这些人也在向张某讨债。大港的于先生也是“玉石圈钱”的受害者,他说,张某利用先送玉石再借钱的办法,先后从他手中借了数十万元,分文未还。昨天在于先生家中,记者见到了张某送给他的部分玉石——两个翡翠摆件,两个挂件。于先生说:“张某有一套非常独特的圈钱手法,就是利用一般人不会识别玉石的品质、可以漫天要价的特点,把玉石当做敲门砖。”

  “玉石圈钱”让当事人上当后维权困难。“她充分利用‘金银有价玉无价’这个规律,她可以说,我给你的玉石价值多少多少万元。”于先生说,“现在北京丰台区法院也有一个张某被诉的案子,她应诉使用的也是这个套路,不但不认30万元的账,反而说原告欠她价值50万元的玉石。实际上她拿来的玉石全是劣质货甚至假货。”于先生希望以自己的遭遇警醒市民,一定要在知识完备或专业人士指点下购买玉石,在了解前不宜盲目消费。


TAG:玉石圈钱骗局:女子损失230万

玉雕《清明上河图》获百花奖金奖

玉雕《清明上河图》获百花奖金奖

  近十米的翡翠玉雕《清明上河图》日前获得2012中国玉(石)器“百花奖”特等金奖。这座翡翠巨雕《清明上河图》,原石材料为缅甸老坑种的绿、紫、白三彩高档翡翠,重达2.2吨,尺寸约为宋代张择端所做原画的两倍。

  这件玉雕由北京工美集团技术中心策划,数位著名玉雕大师耗时4年完成,并配以名贵金丝楠木精细雕刻的框架。在近千件作品中获得特等金奖,《清明上河图》无疑代表了中国翡翠玉雕的最高水平。


TAG:玉雕《清明上河图》获百花奖金奖

2012-06-23

Look Ma, no network: Group drives LTE Direct

Look Ma, no network: Group drives LTE Direct

SAN FRANCISCO – More than a dozen companies are supporting a proposed standard for device-to-device links in Long Term Evolution handsets. They believe Direct LTE will offer capabilities and power efficiency for location-based applications not available with today’s Wi-Fi Direct and GPS links.

Direct-LTE is based on line-of-sight links at a range up to 500 meters and 20-23 dBm signaling limits. The technique could discover local users more quickly with less processing overhead than Wi-Fi Direct or GPS, said Mahesh Makhijani, a director of technical marketing at Qualcomm, in a presentation at the conference here of the NGMN Alliance.

Qualcomm said in its internal tests, LTE Direct discovered as many as 7,200 terminals in 0.64 seconds compared to 369 terminals found in using Wi-Fi Direct that took 82 to 119 seconds. The chip makers tests also found latency for Wi-Fi Direct discovery degraded significantly as device density increased.

Nevertheless, Makhijani said LTE Direct could work with Wi-Fi Direct. For example, in some cases it might be more useful to send data via Wi-Fi Direct after devices had been found using LTE Direct, he said.

A wide range of operators, system and chip companies back the idea, including Alcatel-Lucent, Deutche Telekom, LG, NEC and Nokia. They proposed adding Direct LTE to the 3GPP group’s LTE Release 12, slated to be available in 2015. However, the group may consider defining an ad hoc standard to get Direct LTE into products earlier.

Direct LTE could support “proximity services that provide more value to the mobile network,” said Makhijani.

A handful of emerging mobile applications are adopting the concept of ambient awareness including FourSquare Radar and the Twitter Discovery tab. Venture capitalists spent an estimates $500 million on the theme over the last year, said Makhijani.

Qualcomm showed a simulation of Direct LTE at the event. The technique requires upgraded transceivers in handsets, not yet available in current chip sets.
TAG:LTE Direct Device To Device Wi Fi Direct LTE Handsets Qualcomm Cellular

Look Ma, no network: Group drives LTE Direct

Look Ma, no network: Group drives LTE Direct

SAN FRANCISCO – More than a dozen companies are supporting a proposed standard for device-to-device links in Long Term Evolution handsets. They believe Direct LTE will offer capabilities and power efficiency for location-based applications not available with today’s Wi-Fi Direct and GPS links.

Direct-LTE is based on line-of-sight links at a range up to 500 meters and 20-23 dBm signaling limits. The technique could discover local users more quickly with less processing overhead than Wi-Fi Direct or GPS, said Mahesh Makhijani, a director of technical marketing at Qualcomm, in a presentation at the conference here of the NGMN Alliance.

Qualcomm said in its internal tests, LTE Direct discovered as many as 7,200 terminals in 0.64 seconds compared to 369 terminals found in using Wi-Fi Direct that took 82 to 119 seconds. The chip makers tests also found latency for Wi-Fi Direct discovery degraded significantly as device density increased.

Nevertheless, Makhijani said LTE Direct could work with Wi-Fi Direct. For example, in some cases it might be more useful to send data via Wi-Fi Direct after devices had been found using LTE Direct, he said.

A wide range of operators, system and chip companies back the idea, including Alcatel-Lucent, Deutche Telekom, LG, NEC and Nokia. They proposed adding Direct LTE to the 3GPP group’s LTE Release 12, slated to be available in 2015. However, the group may consider defining an ad hoc standard to get Direct LTE into products earlier.

Direct LTE could support “proximity services that provide more value to the mobile network,” said Makhijani.

A handful of emerging mobile applications are adopting the concept of ambient awareness including FourSquare Radar and the Twitter Discovery tab. Venture capitalists spent an estimates $500 million on the theme over the last year, said Makhijani.

Qualcomm showed a simulation of Direct LTE at the event. The technique requires upgraded transceivers in handsets, not yet available in current chip sets.
TAG:LTE Direct Device To Device Wi Fi Direct LTE Handsets Qualcomm Cellular

Small cells still not ready for mobile prime time

Small cells still not ready for mobile prime time

SAN FRANCISCO – Engineers still have significant work ahead to deliver small cell base stations, a key piece of the puzzle for easing congestion on heavily loaded mobile data networks.

Powerwave Technologies (Santa Ana, Calif.) showed what it claimed was one of the first shipping small cell base stations at the NGMN Alliance conference here recently (below, left). Although it is being used in a small-cell network for a U.S. government department, the small cells do not yet interoperate with traditional macro base stations.

So far the traditional base station suppliers have not disclosed details of their X2 interconnects that companies such as Powerwave need to link to the macro cells. Release 10 of Long Term Evolution specifies an inter-cell interference mitigation standard over X2, but operators are not expected to start deploying Release 10 until sometime in 2013.

Qualcomm showed a demo at the event of the inter-cell interference technology working on prototype chip sets installed in base stations at its San Diego headquarters. It did not say when those chip sets will ship.

The amount of cellular coverage area subject to inter-cell interference grows from 25 percent with macro cells to 40 percent with macro and small cells, said Andrew Jun, vice president of network strategy at cellular operator KT in Korea that has created centralized pools of 144 to 1,000 cell sites.

“This is why we introduced [base station] virtualization” said Jun. “With one location managing multiple cells we could have coordinated transmissions to control interference, especially at the cell edge,” he said.

“It’s only a matter of when” until small and macro cell interoperability is ready, said Khurram Sheikh, chief technologist of Powerwave in a panel session at the event. He claimed his company’s small cells support both LTE and Wi-Fi and can increase an operator’s network capacity fifteen-fold while increasing battery life five-fold.

A carrier can increase its capacity as much as twenty-fold adopting heterogeneous networks of small and macro cells, but only if it pools all its spectrum into one combined 3G and LTE net, said Erik Ekudden, head of technology strategy at Ericsson. Most OEMs are still in the design phase for small cells with field trials starting next year, he added.

For its part, Huawei described at the event a merged LTE and 802.11n Wi-Fi hotspot based on Release 8. It can support downloads at about 1.2 Gbits/second using 256 QAM and is now in a lab prototype based on FPGAs and DSPs, said a Huawei engineer.

“Everybody has nice stuff on their slides, but go try to find a good commercial small cell--I can’t find a single vendor to supply one, said Konstantin Yurganov, chief technology officer at Yota, a 4G supplier in Russia, in a talk at the event.

The carrier has as many as 15 percent of its base stations heavily loaded in some cities with as many as 70 to 160 subscribers on a single base station, he said.

Ultimately, small cells will be deployed both in public areas such as lamp posts and in businesses such as cafes and offices. That’s opening up an opportunity for enterprise networking companies to participate.

In a keynote talk, Paul Mankiewich (right), chief technologist for mobility at Cisco Systems, called for a network API enabling broad virtualization across carrier and business nets. The API could build upon technology already in the works at the Wi-Fi Alliance to help identify traffic on public versus private Wi-Fi hotspots, he said.

“We don’t have coherence between enterprise and service provider networks today,” said Mankiewich. “All that depends on two sets of standards that don’t speak to each other today,” he said.
TAG:Inter Cell Interference Small Cells Base Stations NGMN Alliance Basestations LTE NGMN Ericsson Huawei Powerwave LTE

Sony to spend $1-billion on CMOS sensor production

Sony to spend $1-billion on CMOS sensor production


LONDON – Sony Corp. (Tokyo, Japan) has announced that it plans to spend about 80 billion yen (about $1 billion) by September 2013 to expand its manufacturing capacity for stacked CMOS image sensors.

The investment in Sony Semiconductor's Nagasaki wafer fab, includes 45 billion yen already assigned to capex in the current financial year that ends on March 31, 2013, will increase Sony's production capacity for image sensors to 60,000 wafers per month.

Stacked CMOS image sensors attach the back-illuminated sensors on to ICs that perform signal processing, rather than using substrates to support both the back-illuminated CMOS image sensors and processing IC. Stacked CMOS image sensors smaller sized of image sensors and allow more compact size for digital cameras and mobile devices, Sony said.

The billion-dollar spend is intended to solidify Sony's position as the largest maker of CMOS image sensors and address the rapidly increasing demand for image sensors for use in smartphones and tablet computers, Sony said.

Sony will benefit from a government subsidy that will be provided by the Ministry of Economy, Trade and Industry in Japan, through the "Subsidy for Domestic Location Promotion Projects" program. Sony did not indicate the size of the subsidy.



Sony Semiconductor's Nagasaki Technology Center

Sony has 200-mm wafer production lines for CMOS images sensors at Kagoshima and Nagasaki and the company also outsources CMOS image sensor production to foundries. For the purposes of calculating the monthly output production has been recalculated to 300-mm diameter wafer equivalents.


Related links and articles:

www.sony.net

News articles:


Reports: Olympus-Sony partnership

Yole: Sony, Silex, Dalsa shine in MEMS foundry ranking

Report: CMOS in, CCD out of image focus



TAG:Sony CMOS image sensor smartphone tablet

Sony to spend $1-billion on CMOS sensor production

Sony to spend $1-billion on CMOS sensor production


LONDON – Sony Corp. (Tokyo, Japan) has announced that it plans to spend about 80 billion yen (about $1 billion) by September 2013 to expand its manufacturing capacity for stacked CMOS image sensors.

The investment in Sony Semiconductor's Nagasaki wafer fab, includes 45 billion yen already assigned to capex in the current financial year that ends on March 31, 2013, will increase Sony's production capacity for image sensors to 60,000 wafers per month.

Stacked CMOS image sensors attach the back-illuminated sensors on to ICs that perform signal processing, rather than using substrates to support both the back-illuminated CMOS image sensors and processing IC. Stacked CMOS image sensors smaller sized of image sensors and allow more compact size for digital cameras and mobile devices, Sony said.

The billion-dollar spend is intended to solidify Sony's position as the largest maker of CMOS image sensors and address the rapidly increasing demand for image sensors for use in smartphones and tablet computers, Sony said.

Sony will benefit from a government subsidy that will be provided by the Ministry of Economy, Trade and Industry in Japan, through the "Subsidy for Domestic Location Promotion Projects" program. Sony did not indicate the size of the subsidy.



Sony Semiconductor's Nagasaki Technology Center

Sony has 200-mm wafer production lines for CMOS images sensors at Kagoshima and Nagasaki and the company also outsources CMOS image sensor production to foundries. For the purposes of calculating the monthly output production has been recalculated to 300-mm diameter wafer equivalents.




TAG:Sony CMOS image sensor smartphone tablet

2012-06-22

A passionate teacher with good chemistry

A passionate teacher with good chemistry

APPLETON, Wis. – Kara Pezzi didn’t want to be a teacher.

With a degree in chemistry from the University of Wisconsinat Superior and plans to pursue a Ph.D in chemistry down at UW-Madison, Pezzi couldn’tinitially see teaching as the best way to pursue her passion for science. “Iwanted to be a chemist,” she recalled during an interview this week in a high schoolclassroom here.

Serving as a graduate teaching assistant, however, sherealized that a doctorate in chemistry “was not the path my life would take.”

High school chemistry teacher Kara Pezzi will be recognized as Wisconsin's top science teacher under the Presidential Awards for Excellence in Mathematics and Science Teaching.

Pezzi quickly found that she took to teaching undergraduatechemistry like a fish to water. “I found my passion,” she remembered. It was “achance to share my love of chemistry, a chance to open the eyes of youngpeople, to show them the world from a different perspective.”

Next week (June 27), Pezzi will be among about 100 math andscience teachers traveling to Washington to be recognized for their efforts througha National Science Foundation program called the Presidential Awards forExcellence in Mathematics and Science Teaching. The teachers’ packed scheduleincludes meetings with NSF officials and members of Congress, a White Housetour and perhaps a meeting with President Obama.

Despite the national recognition, it’s not been a gooddecade for teachers, especially high school teachers. According to someestimates, the percentage of U.S. spending on education has declined by 2percent to 5 percent of total GDP over the last decade. Despite all the talkabout STEM education (science, engineering, technology and mathematics), thereality at the high school level is overcrowded classrooms, distracted studentsuninterested in or fearful of demanding science classes and, of course, harriedteachers.

Pezzi, who is teaching an interdisciplinary summer schoolclass for high school instructors, normally teaches five sections of chemistryat Appleton East High School (the school has gone from three to two chemistryteachers during her 14 years there). Pezzi has about 30 students per class in aroom equipped with 28 lab stations. For many, chemistry will be the toughestclass they take in high school. “They look at science as being really, reallyhard,” she said.

Indeed, the high school has only 60 students taking physics,an elective course that used to be required in the Appleton school district.

Pezzi just shrugs. “It’s not something that’s easy to fix,”the Milwaukee native said.

Along with reducing class sizes, another reform would bedropping standardized testing. Having taught high school chemistry for 20years, Pezzi is convinced that standardized tests don’t work. “Let us teach,”she pleaded.

Despite the long days, students complaining about poor gradesand the pervasive fear of failure on the part of many parents, Pezzi said anoccasional call from a former student makes it all worth it. She recently heardfrom one who is earning a Ph.D in chemistry from Johns Hopkins University inBaltimore. You can sense her pride.

That future chemist and the others whose lives were changed foreverby a thoroughly committed chemistry teacher in this small Upper Midwestern cityare the essence of education.

For that, we all owe a debt of gratitude to our teachers.

And we’re glad Kara Pezzi changed her mind and became a highschool chemistry teacher.


TAG:Kara Pezzi Science Education STEM Chemistry NSF