2012-12-21

清新扇贝跃上指环

清新扇贝跃上指环

  喜欢沿着海岸线散步,缓缓地走在沙滩与波浪拍打的交会处,海浪一波波地朝着你的双脚袭来又退去,感觉洗去了在水泥丛林里的都市尘埃。Kate Spade 最新送上的饰品系列,即大举注入扇贝形状元素,半弧形的连续图样,接二连三地跃上手环、项链、戒指等配饰。主打的两款图样,一为简化过后的扇贝图形,也像花瓣,搭配缤纷亮丽的颜色,十分可爱迷人;另一则是较为写实的图案,以金色示人,展现成熟女性的魅力,不晓得各位属意哪款呢?




TAG:珠宝 Kate Spade 扇贝形状 连续图样 清新扇贝跃上指环

Globalfoundries: Europe 'fundamentally flawed' on manufacturing

Globalfoundries: Europe 'fundamentally flawed' on manufacturing


SAN FRANCISCO--Europe has its priorities misplaced when it comes to manufacturing, according to Globalfoundries CEO Ajit Manocha.

Manocha said there is a “fatal flaw” in the European Commission’s thinking when it comes to technology, with the organization putting all of its focus and resources into innovation while neglecting manufacturing.

Manocha said the only thing keeping European manufacturing afloat was the automobile industry, which continued to fuel growth, but that if Europe did not start taking more initiative in other manufacturing areas, Asia would continue to see its manufacturing prowess boosted.

“The benefit of European demand won’t be felt unless Brussels begins to put some emphasis on manufacturing,” he said, adding “Europe is not playing its role properly.”

Manocha said Asian countries rolled out “the red carpet” for foundries in terms of subsidies and facilitating business. Meanwhile, despite frequent meetings in Brussels, Manocha said he feels he is not making headway.

“Brussels needs to wake up and call,” he concluded.

Related Stories

Foundries not dead, just evolving, says Globalfoundries CEO
GlobalFoundries puts rivals on notice, tips 20-nm process
Globalfoundries appoints interim CEO
Globalfoundries looks to leapfrog fab rivals
GlobalFoundries charts road to 14 nm
Globalfoundries CEO says company is back on track


TAG:manufacturing globalfoundries europe

Aldec shares verification white papers

Aldec shares verification white papers

The folks at Aldec asked me to "spread the word" regarding the availability of their most-viewed white papers on verification as follows:

Those Pesky Interfaces…
SystemVerilog Interfaces offer some very interesting features for both hardware designers and verification engineers. Unfortunately, they are also one of the most misunderstood SV constructs. This document tries to explain interfaces, paying special attention to the virtual interface concept used in popular UVM library. Download paper

Debugging SCE-MI Co-Emulation
Learn about Aldec’s debugging environment for SCE-MI co-emulation that provides 100% signal visibility of the design running in an FPGA-based emulator. Download paper

Randomization and Functional Coverage in VHDL
Modern digital designs reach the scale of complete systems and require support of Constrained Random Test and Functional Coverage in verification. Although VHDL does not have built-in, direct support for those methodologies, there are solutions that allow their quick implementation in your testbench. Download paper

DO-254 - Increasing Verification Coverage by Test
Verification coverage by test is essential to satisfying the objectives of DO-254. However, verification of requirements by test during final board testing is challenging and time-consuming. This white paper explains the reasons behind these challenges, and provides recommendations how to overcome them. The recommendations center around Aldec’s unique device testing methodology that can significantly increase verification coverage by test. Download paper

Clarifying Language Methodology Confusion
Addresses the challenges of changing languages, methodologies and tools, that are faced when working with large, modern FPGA designs. Download paper


Click Here to view all of Aldec's whitepapers.


If you found this article to be of interest, visit Programmable Logic Designline where – in addition to my Max's Cool Beans blogs – you will find the latest and greatest design, technology, product, and news articles with regard to programmable logic devices of every flavor and size (FPGAs, CPLDs, CSSPs, PSoCs...).

Also, you can obtain a highlights update delivered directly to your inbox by signing up for my weekly newsletter – just Click Here to request this newsletter using the Manage Newsletters tab (if you aren't already a member you'll be asked to register, but it's free and painless so don't let that stop you [grin]).
TAG:Aldec

Servers cool it with liquid refrigerant

Servers cool it with liquid refrigerant


SAN JOSE, Calif. – Phil Hughes claims he can pack 200 KW of electronics—maybe more--into a single server rack. A top tier OEM and a government lab are now kicking the tires on the cooling technology of his startup, Clustered Systems Co. (Santa Clara, Calif.).

Originally Hughes planned to build a supercomputer around a new mesh networking technology he helped develop. But he and his investors discovered their approach to cooling the system was even more valuable than the supercomputer design itself.

Clustered Systems uses sealed cold plates filed with R134a, the same stuff used in car air conditioning systems. The cold plates sit next to heat risers, blocks of aluminum that channel heat from the electronics.

The heat boils the refrigerant sending gas and a little remaining liquid off to an external heat exchanger. Outside the server box, cold water or ambient cool air makes the refrigerant condense back to a liquid that cycles back to the server plate.


TAG:Data Centers Clustered Systems Phil Hughes Cooling Servers Refrigerant

2012-12-20

Ericsson writes off $1.2 billion

Ericsson writes off $1.2 billion


LONDON – Telecommunications equipment supplier Ericsson AB has announced it will take a non-cash charge of about 8 billion krona (about $1.2 billion) in the fourth quarter of 2012, related to its 50 percent stake in the loss-making mobile chip company ST-Ericsson NV.

Ericsson said it had decided not to acquire a full majority of ST-Ericsson but that it would continue to explore strategic options for the joint venture. Co-owner STMicroelectronics recently announced its intention to exit from the venture by the end of 3Q13.

The charge reflects a write down of assets to reflect market value and includes about 3 billion krona (about $500 million) for the implementation of strategic options which Ericsson said it expects to be taken in 2013.

Ericsson said it continues to believe that the modem technology, which it originally contributed to the JV, has a strategic value for the wireless industry. It re-iterated that a priority of the process is a successful market introduction of LTE modems.


Related links and articles:

ST to exit ST-Ericsson in 2013

London Calling: Whither ST?

ST-Ericsson vows to keep working on turnaround

TAG:Ericsson ST Ericsson STMicroelectronics semiconductor IP mobile LTE modem

Imagination wins MIPS bid

Imagination wins MIPS bid


LONDON – DSP IP licensor Ceva Inc. (Mountain View, Calif.) has announced that it will not rebid against Imagination Technologies Group plc for processor IP company MIPS Technologies Inc.

Graphics IP licensor Imagination (Kings Langley, England) started the process in early November with a bid of $60 million to buy MIPS's operating business and certain patents while another U.K. company, ARM Holdings plc (Cambridge, England), would lead a consortium called Bridge Crossing that would acquire rights to the major part of the MIPS portfolio of patents as a form of legal protection. Bridge Crossing is set to pay $350 million in cash to purchase the rights to the MIPS portfolio, of which ARM will contribute $167.5 million.

Ceva bid twice against forcing Imagination to rebid up to a level of $100 million. Ceva said that while there had been merit in trying to acquire MIPS, at the level reached it would rather preserve its cash for other opportunities.

Imagination wants to acquire MIPS, a pioneer of 32- and 64-bit processing, to help boost its position against ARM Holdings which offers both general purpose and graphics processors for license.

Imagination is expected to have to borrow about $22 million to help fund its higher offer.


Related links and articles:

Imagination raises MIPS bid

Ceva rebids for MIPS to stretch Imagination

MIPS rolls architecture extensions amid bidding war

TAG:Imagination MIPS Ceva IP GPU CPU processor semiconductor DSP

Report: TSMC confirms U.S. wafer fab site hunt

Report: TSMC confirms U.S. wafer fab site hunt


LONDON – Amid plans to increase capital spending to a record $9 billion in 2013, Taiwanese foundry TSMC is seeking a location for a wafer fab, with the U.S. as a possibility, according to a local news report.

Commenting on speculation that TSMC (Hsinchu, Taiwan) might build a fab in New York, Morris Chang, chairman and CEO of TSMC, said that his company is looking for a location for a wafer fab. "The U.S. is one of the places under consideration. But this has nothing to do with Apple," the Taipei Times quoted Chang as saying. Chang was speaking at the Supply Chain Management Forum in Hsinchu, Taiwan.

It has been speculated that TSMC might be the entity behind Project Azalea that is considering build a factory in New York state, or behind a similarly named project in Oregon. It has also been speculated that TSMC might be considering a U.S. site under pressure from Apple, which has become an important buyers of foundry services for the processors it uses in its smart phones and tablet computers.

TSMC has budgeted $8.3 billion for capital spending in 2012, which it will increase to $9 billion in 2013. At the same time the budget for R&D is $1.37 billion in 2012 and is due to expand by 17 percent to $1.6 billion in 2013, the report quoted Chang as saying.

The capital spending will help TSMC expand manufacturing capacity particularly of leading-edge 28-nm process technology which has been in short supply during 2012. TSMC also expects to bring up a 20-nm bulk planar CMOS process in 2013.

Chang said he expects the global chip market to grow 3 percent next year after a fall of 2 percent in 2012, although he expects TSMC to grow by 15 to 20 percent in 2013, the report added.


Related links and articles:


Taipei Times article

London Calling: Is Oregon courting fab project?

London Calling: TSMC next for New York fab?

TSMC said to plan 450-mm production for 2018

Europe's role in wafer transition at risk, says analyst


TAG:Taipei Times Morris Chang TSMC wafer fab Project Azalea New York Oregon foundry semiconductor capex

少年派大热掀起印度珠宝风

少年派大热掀起印度珠宝风

  自从《少年派的奇幻漂流》大热后,印度这个极具民族风情国度再次以华丽之姿跃入我们的眼帘。印度珠宝则是这个国度的印象元素中很重要的一部分,出嫁时,印度女生身上重头戏之一则是繁复又色彩鲜艳的印度珠宝。印度珠宝品牌Zoya近日推出了全新的珠宝系列,在繁花与金银回转之间是否找到了少年派的影子呢?




TAG:珠宝 Zoya 印度珠宝 金银 少年派大热掀起印度珠宝风

Cleantech outlook gloomy for VCs

Cleantech outlook gloomy for VCs


SAN JOSE, Calif. – Venture capitalists and startup chief executives are generally lowering their expectations about the U.S. economy in 2013 as well as market sectors including cleantech and medical devices. However they are generally most bullish on business and health care IT spending and Latin America, according to a new survey.

Forty-nine and 42 percent of startup CEOs and VCs respectively expect the U.S. economy to improve next year, according to the 2013 Venture View survey conducted by the National Venture Capital Association (NVCA) and Dow Jones VentureSource. That’s down from last year when 53 and 47 percent of the two groups expected economic improvements.

Expectations for overall VC spending in 2013 also went down slightly in the latest survey. Forty-three percent of startup CEOs and 27 percent of VCs said they expect VC spending will rise next year, down from 45 and 32 percent in last year’s survey.

“Ongoing uncertainty surrounding the fiscal cliff clearly impacted respondents’ outlooks for the coming year,” said NVCA president Mark Heesen. “The influence the federal government has over the growth or stagnation of our industry has never been greater, [and] lawmakers need to understand that their brinkmanship politics is hurting the entrepreneurial ecosystem, which has been grasping for positive news for the last four years."

Click on image to enlarge.

Most respondents expect to see increased spending in business IT (61 percent) and health care IT (57 percent) in 2013 (see graph above). They expect decreases in clean technology investments (61 percent) and medical devices (53 percent).

Geographically, 55 percent of respondents said Latin America will see increasing U.S. investment in 2013 followed by China (40 percent) and India (37 percent). U.S. investments are most likely to decrease in Western Europe, said 55 percent of respondents, followed by Eastern Europe (36 percent) and Japan (30 percent).

The survey queried more than 600 U.S. executives between Nov. 26 and Dec. 7.

Related stories:

EE Times' Silicon 60: Hot startups to watch

Silicon Valley Nation: It's 'cougar night' for VCs

VCs bolstered silicon investments in Q2

TAG:National Venture Capital Association Dow Jones VentureSource Venture Capitalists Clean Tech Medical Devices Latin America Business IT

你至少要有一件的东方元素珠宝

你至少要有一件的东方元素珠宝

  东方元素珠宝已经多次被提及,无论是中国的吉纹瑞兽,还是印度的奢华繁复,古老的东方文明在珠宝设计上已经绽放出流光溢彩,如果你还对自己珠宝箱的元素风格很模糊,不够演绎自己的母文化,那一件东方元素的珠宝一定可以帮到你,大美东方,越文化越时尚。




TAG:珠宝 东方元素 吉纹瑞兽 奢华繁复 你至少要有一件的东方元素珠宝

Ericsson outlines 10 hot consumer trends for 2013

Ericsson outlines 10 hot consumer trends for 2013

MOUNTAIN VIEW, Calif.,--Infrastructure maker Ericsson Inc. may be more on the network side of things, but that hasn’t stopped the firm’s ConsumerLab from coming up with a list of top trends it sees moving into 2013.

After polling some 100,000 individuals in more than 40 countries and 15 megacities, the firm believes it has identified some key movements for the coming year, including how the cloud is reshaping consumer needs, how women seem to be driving the smartphone market and how the younger demographic is influencing society via the internet.

The first trend, according to Ericsson’s report is that cloud reliance is reshaping device needs. “More than 50 percent of tablet users and well above 40 percent of smartphone users in USA, Japan, Australia and Sweden appreciate the improved simplicity of having the same apps and data seamlessly available through the cloud on multiple devices,” said the report.



The second trend, said Ericsson, is the death of the task list and the rise of impulse decision making from a tablet or handheld device. Purchase intent, the firm found, was becoming ever more spur of the moment and was higher for tablets compared to desktop PCs, and for smartphones compared to laptops.

Bring your own broadband to work is the third trend being pinpointed by Ericsson, with a massive 57 percent of smartphone users admitting to using their personal smartphone subscriptions in the workplace. “Personal smartphones are increasingly being used for work, to send emails, plan business trips, find locations and more,” said Ericsson’s report.

City slickers are going more mobile too, according to the trend report, accessing the internet always and everywhere. Total smartphone subscriptions will reach 3.3 billion by 2018, according to Ericsson, and mobile network coverage is one of the most important drivers of satisfaction for city life says the report.

Making an entrance at number five is the important issue of personal social security networks, which has apparently arisen as a result of economic turbulence and a growing distrust of traditional structures and authorities. Consumers, according to the report, are increasingly placing that trust instead in their personal communities. “Personal networks online serve as a safety net and social media is shaping up to be a serious contender to the traditional job agency,” said the report.

The smartphone market, it seems, is also finding itself increasingly driven by women. New figures clearly show that women drive mass-market smartphone adoption and 97 percent of female smartphone owners also use SMS. A total of 77 percent send and receive photos, 59 percent use social networking, 24 percent check in at locations and 17 percent redeem coupons. Ericsson found that the numbers were lower for men in all of the aforementioned areas.

Click for next page >>
Next: Trending urban?
TAG:infrastructure mobile network consumer

LTE smartphone sales seen tripling in 2013

LTE smartphone sales seen tripling in 2013


SAN JOSE, Calif. – Global sales of LTE smartphones will triple in 2013 to 275 million handsets, according to market watchers Strategy Analytics (Boston). When the books are closed on 2012, it estimates vendors will have sold about 90 million LTE handsets.

Much of the growth will come from the U. S, the United Kingdom, Japan, China and South Korea. Multiple operators, such as Verizon Wireless, Everything Everywhere and NTT Docomo, are aggressively expanding their LTE networks, Neil Shah, a senior analyst at Strategy Analytics, said in a statement.

Vendors leading the push into LTE smartphones include Apple, Samsung, LG, Nokia, HTC, Motorola, Blackberry, Huawei, ZTE and Pantech. Popular LTE smartphone models will include Apple’s iPhone 5 and Samsung’s Galaxy S3, he added.

“LTE has quickly become a high-growth, high-value market that no operator, service developer, component maker or device vendor can afford to ignore,” said Neil Mawston, an executive director at Strategy Analytics, noting dozens of new LTE smartphones will be launched in 2013.

“We believe [the growth] will eventually attract new entrants seeking a slice of the 4G pie, such as Amazon or Mozilla,” said Linda Sui, an analyst for the market watcher. “However, we caution possible new entrants like Amazon will not find it easy to break into the fiercely competitive market, and they will need breakthrough products that are strongly differentiated in areas such as design, price or services,” she said.

Related stories:

Yoshida in China: Key to LTE winners is China Mobile

Altair, Sequans drive TD-LTE in India, U.S.

Look Ma, no network: Group drives LTE Direct

TAG:LTE Smartphones Startegy Analytics LTE Smartphones Handsets 4G Apple Samsung LG

ASSET's FPGA-based instruments for testing on-board memory

ASSET's FPGA-based instruments for testing on-board memory

Two new instruments for ASSET InterTech’s ScanWorks platform for embedded instruments have been named finalists by Test & Measurement World in its 2013 Best in Test awards program.

ASSET is a leading supplier of tools for embedded instrumentation. ASSET’s instrumentation intellectual property (IP) supports the new IEEE P1687 Internal JTAG (IJTAG) standard for embedded instruments.

“It is always an honor when our chip and board test technologies are recognized for the breakthrough capabilities they provide,” said Glenn Woppman, president and CEO of ASSET InterTech. “Over the years, engineers have been able to turn to Test and Measurement World’s Best in Test awards for guidance on the leading test products introduced the previous year. This year is no exception and we are very pleased that our new ScanWorks embedded instruments for on-board memory test have earned the distinction of being named finalists.”

The ScanWorks FPGA-controlled test (FCT) toolkit is the first to automatically insert multiple instruments into an FPGA, configure and connect the instruments as a cohesive board-tester-in-a-chip, and operate the tester from an intuitive drag-and-drop interface. The two embedded instruments named Best in Test finalists involve testing on-board memory. One is a DDR2/DDR3 memory link tester and the second instrument is a generic memory test instrument. Both test memory buses from the inside out, eliminating the need for expensive probe-based external instruments and testers. The FPGA host of ScanWorks FCT does not need to be dedicated to test. FCT can be inserted in a functional FPGA and removed when it is no longer needed. For example, a ScanWorks FCT board tester might be inserted in an FPGA, used to bring up early prototypes and then removed. Later, it might be inserted and removed again during volume manufacturing or field service.

FCT is just one of the several non-intrusive validation, test and debug technologies that make up the ScanWorks platform for embedded instruments. Users can configure the ScanWorks platform to meet their specific needs and overcome the growing deficiencies of traditional legacy intrusive instruments and testers which are losing physical access for their probes. The other non-intrusive technologies supported by ScanWorks include boundary-scan test (BST), processor-controlled test (PCT) and high-speed I/O (HSIO) signal integrity validation.


If you found this article to be of interest, visit Programmable Logic Designline where – in addition to my Max's Cool Beans blogs – you will find the latest and greatest design, technology, product, and news articles with regard to programmable logic devices of every flavor and size (FPGAs, CPLDs, CSSPs, PSoCs...).

Also, you can obtain a highlights update delivered directly to your inbox by signing up for my weekly newsletter – just Click Here to request this newsletter using the Manage Newsletters tab (if you aren't already a member you'll be asked to register, but it's free and painless so don't let that stop you [grin]).
TAG:FPGA based instruments

Mentor's Rhines sees 'modest growth' in 2013

Mentor's Rhines sees 'modest growth' in 2013


BANGALORE, India -- Global economic uncertainty is contributing to a down year for the global semiconductor industry, but 2013 could bring “modest growth, according to Mentor Graphics CEO Wally Rhines

Rhines, here last week for a developers’ conference, said in an interview that 2012 industry revenues should approach $300 billion, a decline from the previous year, but foresees “modest growth [as] the most likely scenario next year after negative growth this year.”

“Though analysts are forecasting some growth next year, most executives in the semiconductor industry are nervous about growth ahead,” Rhines added. “There is too much uncertainty in too many places. There are some parts of the electronics industry that are doing quite well, like wireless. But there is lots of turmoil too.”

He cited the decline of smartphone makers like Nokia and chip maker Texas Instruments, which is facing stiff competition from Qualcomm. “So [there are] lots of leadership changes, and these changes are causing disruption.”

The uncertainty is being offset by consumer enthusiasm for low-cost electronics. “The demand for the advanced semiconductor technology, 28 nanometers and below has been very strong, and this would be good for the semiconductor industry on the whole next year. The foundries have made a big bet on the 28 and 20 nanometer [process technology], and they have more than doubled their normal capital investment,’’ Rhines stressed.


Inventory plays a big role in the semiconductor industry. Companies stock inventory in proportion to their expectations of either growing or declining demand. But Rhines said market uncertainty is making it difficult for supply chain managers to gauge inventory requirements. “Semiconductors are like fish,” he said. “If you keep them around a bit too long, they start to smell. So the value of the inventory decreases if you hold it too long. Semiconductor prices don’t go up, they always go down.”


Next: Semiconductor cycle
TAG:Wally Rhines Mentor Graphics Global Economy Chip Forecast Semiconductors Rhines Mentor

Top 10 tech blunders of 2012

Top 10 tech blunders of 2012


In a year that saw consolidation around several electronics ecosystems (think Apple), 2012 also had its share of missteps (think Apple, again). In the pages that follow, we chronicle the year’s most notable corporate delays, false steps, miscalculations and screw-ups.

They say there is no experience without suffering. Let’s hope those who goofed in 2012 learn from their mistakes.

Apple loses its way on maps

The engine of the “iEconomy” was already taking a beating over reports of labor abuses at its leading manufacturing partner, Foxconn, when the roll out of the iPhone 5 in the fall was overshadowed by a map-app fiasco. Under new CEO Tim Cook, Apple decided to ditch a reliable Google maps system for a poorly designed and inadequately tested version that led users astray and became the butt of talk-show jokes. The consumer electronics giants apologized profusely and vowed to fix the iPhone’s map app, but reports were still trickling in at year’s end of lost, confused and angry users.

Lesson: Don’t try to reinvent the wheel, even if you are the biggest corporation on Earth.


A bum steer?


Related stories:

Teardown: Inside Apple 's iPhone 5

Will maps snafu hurt Apple?






TAG:Technology Blunders Blunders Apple Google HP Sharp EUV Freescale A123 Autonomy WSTS AMD RIM Nokia Qualcomm

Top tech blunders of 2012

Top tech blunders of 2012


In a year that saw consolidation around several electronics ecosystems (think Apple), 2012 also had its share of missteps (think Apple, again). In the pages that follow, we chronicle the year’s most notable corporate delays, false steps, miscalculations and screw-ups.

They say there is no experience without suffering. Let’s hope those who goofed in 2012 learn from their mistakes.

Apple loses its way on maps

The engine of the “iEconomy” was already taking a beating over reports of labor abuses at its leading manufacturing partner, Foxconn, when the roll out of the iPhone 5 in the fall was overshadowed by a map-app fiasco. Under new CEO Tim Cook, Apple decided to ditch a reliable Google maps system for a poorly designed and inadequately tested version that led users astray and became the butt of talk-show jokes. The consumer electronics giants apologized profusely and vowed to fix the iPhone’s map app, but reports were still trickling in at year’s end of lost, confused and angry users.

Lesson: Don’t try to reinvent the wheel, even if you are the biggest corporation on Earth.


A bum steer?


Related stories:

Teardown: Inside Apple 's iPhone 5

Will maps snafu hurt Apple?






TAG:Technology Blunders Blunders Apple Google HP Sharp EUV Freescale A123 Autonomy WSTS AMD RIM Nokia Qualcomm

2012-12-19

Oregon courts Azalea project, says report

Oregon courts Azalea project, says report


LONDON – Business Oregon, the state's economic development agency, is trying to attract a company to invest there that is working under the codename Azalea, according to The Oregonian newspaper.

While confirming the activity, Business Oregon declined to provide details, the report said. The report goes on to tie the action in Oregon with a technology-based inward investment activity labeled Project Azalea that is looking at multiple sites in upstate New York.

Reports have been circulating through November that a major semiconductor company has retained consulting firm Deloitte Touche Tohmatsu Ltd. to find a location for a 3.2 million square foot production facility that could employ 1,000 people.

Speculation has included the possibility that foundry chipmaker Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan) might be looking to set down a wafer fab in North America to help it win the business of making processors for Apple. At present Samsung makes those processors for Apple at a fab in Austin, Texas. Apple and Samsung have been locked in legal disputes for more than a year as they fight for market dominance in the smart phone and tablet computer markets.

The leading chip making companies in New York are Globalfoundries Inc. and IBM Corp. but there is also substantial R&D activity on lithography and on the transition to 450-mm diameter wafers for manufacturing. In Oregon, Intel is the largest private employer and leading major chip manufacturing presence.

An alternative suggestion is that Project Azalea is not about chip manufacturing at all but is again driven by Apple requiring local U.S. manufacturing of liquid crystal displays or indeed complete systems as a part of a policy of repatriating manufacturing to the U.S.

Another possibility is that Apple is creatng a three-way race between Intel, Samsung and TSMC to provide dedicating chip manufacturing capacity for Apple processors within the U.S.


Related links and articles:


Oregon Live article

London Calling: TSMC next for New York fab?

TSMC said to plan 450-mm production for 2018

Europe's role in wafer transition at risk, says analyst



TAG:London Calling Project Azalea New York wafer fab Oregon semiconductor TSMC Intel Samsung Apple

Fab spending decline to continue in 2013

Fab spending decline to continue in 2013


LONDON – Global spending on wafer fab equipment is is expected to reach $29.9 billion in 2012, a decrease of 17.4 percent from $36.2 billion in 2011, according to market research firm Gartner Inc.

Gartner forecast that the decline will continue in 2013 as wafer fab equipment spending goes down to $27 billion, a 9.7 percent decline from 2012, the firm said. The market is projected to return to growth in 2014.

"Demand for new equipment for logic production will soften as yields improve, leading to declining shipment volumes as the industry heads into 2013," Bob Johnson, Gartner research vice president, said in a statement.

Wafer fab manufacturing capacity utilization is a key indicator for the acceleration and deceleration of spending plans. Gartner predicts that utilization will decline below 80 percent by the end of 2012 before slowly increasing to about 85 percent by the end of 2013.

"High inventories, combined with overall market weakness, will continue to depress utilization rates into the first half of 2013," said Johnson.

Leading-edge utilization declined to the mid-80-percent range by the second half of 2012 and will move into the low-90-percent range by the end of 2013. Typically 90 percent is seen as a trigger point for increased wafer fab spending. Memory will continue to be weak through 2013, with maintenance-level investments for DRAM and a slightly down NAND market until supply and demand are in balance, Gartner forecasts. Meanwhile 2014 should begin a growth cycle that is expected to last through 2016.


Related links and articles:

Semiconductor equipment sales continue to slow

Fab tool demand on the decline

Gartner sees 20% drop in IC capex in 2012

TAG:Wafer fab spending Gartner chip manufacture production utilization semiconductor

Globalfoundries mulls third manufacturing option

Globalfoundries mulls third manufacturing option


LONDON – Globalfoundries Inc. is evaluating a third manufacturing option to follow conventional bulk planar CMOS: super-steep retrograde well (SSRW) technology that creates a ground plane under a transistor using a doping technique.

The technology appears to be very similar to that developed by SuVolta Inc. (Los Gatos, Calif.) although Globalfoundries (Milpitas, Calif.) has declined to say whether it is working with or in negotiations with SuVolta.

If adopted, the SSRW process would likely be in addition to previously announced 14XM 14-nm FinFET process due in 2014 and its licensing of 28-nm and 20/14-nm fully-depeleted silicon on insulator (FD-SOI) manufacturing process technology from STMicroelectronics. However, it could potentially compete with both processes for design wins.

The possibility that Globalfoundries could pursue all three options underscores the challenges facing conventional bulk planar CMOS.

Globalfoundries CEO Ajit Manocha referred to SSWR in a presentation during the International Electron Devices Meeting (IEDM) in San Francisco earlier this month. Manocha said SSWR – alongside FinFETs and FDSOI – represents a manufacturing option for fully depleted transistor architectures and that fully depleted transistors offer superior low voltage and electrostatic performance along with scalability.

When SuVolta introduced its deeply depleted channel (DDC) PowerShrink transistor technology it pitched it as an alternative to FinFET and FDSOI processes.




TAG:Globalfoundries GloFo SSWR Intel IBM SuVolta semiconductor process bulk CMOS planar FinFET SOI FDSOI

Apple, Nvidia may stack graphics for Macs, iPads

Apple, Nvidia may stack graphics for Macs, iPads


SAN JOSE, Calif. – Nvidia could develop chip stacks for Apple that would make for some pretty interesting iMacs, Macbooks and iPads. I’m just speculating on industry rumors, but it makes a lot of sense.

Nvidia could lay two to four graphics chips down on a 2.5-D substrate using through silicon vias to create an ultra powerful graphics-card-on-a -chip driving a muscular iMac. It might even add a memory chip to the mix to create a device with fast memory access, good for either an iMac or Macbook.

What’s more, Nvidia could place one of its new Project Denver ARM cores next to a graphics chip and maybe some memory to enable a high performance, low power Macbook running iOS. A low cost iOS laptop could leapfrog anything we have seen to date out of the Windows 8 crowd.

Here’s the kicker: Apple could supply its A-series SoC to Nvidia which could add graphics and memory to a stack for a high-end iPad. It would create a novel premium product injecting fresh life into tablets at the high end, putting more distance between Apple and its growing Android tablet competitors.

The stacking technology is still too expensive, hot and power hungry for smartphones. But come 2015 or so, it may start appearing there, too, in the form of full 3-D stacks.

This isn’t rocket science. Xilinx started the trend of 2.5-D stacks in late 2011 with an ultra dense chip that put two of its top FPGAs on a single substrate. Huawei said it is working on a similar device using an Altera FPGA and a memory chip for a router.

In computers, IBM is working on 2.5-D chips that marry its Power server processors and memory. IBM is already pitching to customers it a ability to make such stacks as is TSMC which helped make the Xilinx part. One market watcher tells me there are as many as a dozen of these designs in the works for 2013.

Related stories:

Xilinx tips world’s highest capacity FPGA

Huawei, Altera mix FPGA, memory in 2.5-D device

IBM details 3-D server chip stacks

Next: Jen Hsun just smiled
TAG:2 5 D Chip Stacks Chip Stacks 2 5 D Windows 8 Apple iPads Macbooks IMacs IOS Nvidia Graphics Xilinx IBM Huawei

2012-12-18

AMOLEDs on growth path with hurdles

AMOLEDs on growth path with hurdles

MANHASSET, NY -- Active matrix OLED (AMOLED) displays is forecast to more than double by 2015 to 13% after capturing 6% of the small/medium (less than 9 in.) display market in 2012.

According to the NPD DisplaySearch the total OLED display shipments are expected to reach 191 million in 2012, accounting for an 8.4% share of the overall small/medium display category.

“AMOLED displays have driven total OLED penetration into the small/medium display market since 2010 when Samsung launched the Galaxy S, the first AMOLED smartphone in 2010,” said Yoonsung Chung, Director, Large-Area Displays & FPD Materials for NPD DisplaySearch.

Mobile phones continue to drive the growth of the OLED market, and mobile phone applications are expected to have a 69% share of the total small/ medium OLED market in 2012, growing to 83% in 2015.

“Samsung Displays produces nearly all AMOLED displays, but more players will need to participate in order to drive growth of AMOLED technology,” said Chung. “NPD DisplaySearch forecasts that new panel makers will enter the market in 2013, particularly from Taiwan and China. In addition, we expect to see OLED applications for smartphones, amusement devices, digital still cameras, and home appliances drive additional demand.”

Mass adoption of AMOLED technology for newcomers is challenging due to the very detailed and technical engineering and production experience required for OLED manufacturing. On average, successful entry takes five years, according to NPD DisplaySearch. In addition, AMOLED display technology is more expensive to produce, which undoubtedly impacts demand.


Click on image to enlarge.

Small/medium OLED display shipments by application
TAG:AMOLEDs

ARM security, payment JV launches as Trustonic

ARM security, payment JV launches as Trustonic


LONDON – A previously announced security and payments joint venture between ARM, Gemalto and Giesecke & Devrient has been launched under the name Trustonic

Technology from Trustonic Ltd. (Cambridge, England) is intended to make paying for things using electronic equipment simpler and faster, the company said. The company is chartered with development of a trusted execution environment built upon the ARM TrustZone technology and compliant with GlobalPlatform specifications. Trustonic combines TrustZone technology found within ARM-based system-chips with security and management software contributed by Gemalto NV (Amsterdam, The Netherlands) and Giesecke & Devrient GmbH (Munich, Germany).

Trustonic announced that it already has relations with 20th Century Fox, Cisco, Mastercard, Nvidia, Samsung, Sprint and Symantec, amongst others.

Under the original terms of the deal announced in April 2012 ARM owns 40 percent of the joint venture and Gemalto and G&D own 30 percent each.

The company is led by CEO Ben Cade, previously general manager of ARM's secure services division. Jon Geater, chief technology officer, also comes from ARM's secure services division. Chris Jones is the chief operations officer for Trustonic, and was previously vice president of licensing for the processor division of ARM.

Stephan Spitz is the executive vice president of engineering and was previously the director of strategic planning for Giesecke & Devrient. Oliver Leger is set to become the executive vice president responsible for sales and marketing. He is currently the general manager of personal and consumer devices at Trusted Logic, a subsidiary of Gemalto.

The formation of the joint venture has been approved by the European Commission and Chinese authorities on condition that ARM provides the joint venture's competitors with information on current and future versions of TrustZone and other equivalent architectures that ARM may release in the future and that ARM does not design its IP in a way to degrade the performance of third-party trusted execution environments.


Related links and articles:

www.trustonic.com

www.globalplatform.org

News articles:


Report: China approves ARM venture with conditions


ARM, security firms form joint venture for mobile

London Calling: Europe offers security to the world


TAG:GieseckeandDevrientARMGemaltoTrustonic

PLX, Kontron drive PCIe backplane to 5.6 GB/s

PLX, Kontron drive PCIe backplane to 5.6 GB/s


SAN JOSE, Calif. – Chip designer PLX Technology, Inc. and board maker Kontron announced a design using PCI Express 3.0 to “routinely achieve” 5.6 GBytes/second in throughput between boards in a rack system.

The design uses PLX’s ExpressLane switch chips and Kontron’s VX3042 and VX3044 single-board computers based on the Intel Core i7 processor running in a VPX rack. The boards also use Kontron’s proprietary VXFabric software, geared for inter-processor communications in a VPX system.

VXFabric implements TCP/IP over PCIe as a second data plane in addition to two 10 Gbit Ethernet channels on the boards. The software supports links to the PLX switches allowing the boards to use existing TCP/IP application without modifications.

"Embedded-computer systems rarely realize a tenfold increase in I/O performance and with absolutely no porting effort,” said Vincent Chuffart, product marketing manager, Kontron in a press statement.

Related stories:

PCI Express 4.0 drives to 16 GT/second

PLX preps PCI Express fabric amid server debate

TAG:PCI Express 3 0 PCIe 3 0 PCI Express PCIe Backplanes PLX Kontron Interconnects Switches

Slideshow: Top 10 shifts in chips, comms

Slideshow: Top 10 shifts in chips, comms


SAN JOSE, Calif. – It was a tough year. When it was all over, the semiconductor industry contracted about four percent, according to market watchers who spent much of the year revising their forecasts downward.

Much of the blame belongs to Europe. Greece, Spain, Italy and Ireland took turns threatening a fiscal collapse that could pull down the European Union with it. The U.S. struggled through a sluggish recovery as it watched. Even the big bull and global growth engine of China pulled in its horns, expecting a storm.

A summary follows.


Click on image to enlarge.

  • A down year
  • The shift to the mobile cloud
  • The rise of the mega data center
  • Moore’s Law slows
  • The winners: ARM
  • MIPS on the ropes
  • More winners: Apple, Samsung, Qualcomm
  • Roads diverge for Wintel
  • The Losers: Elpida, Nokia, AMD, Renesas, STM, TI
  • The next big thing in networking: SDN

Next: Shift to mobile cloud
TAG:2012 Semiconductors Communications Recovery Economy Mobile Cloud SDN Intel ARM AMD China Microsoft Elpida Apple Samsung Otel

Yoshida in China: Demystifying Apple’s iPhone 5 launch

Yoshida in China: Demystifying Apple’s iPhone 5 launch


MADISON, Wis. – When Apple announced Sunday (Dec. 16) that it had sold more than 2 million iPhone 5s in China, many seemed shocked over the ravenous appetite of Chinese consumers for smartphone. “Record China sales of iPhone 5,” the headlines screamed.

With a seemingly insatiable appetite for news about Apple, most of the reports seem to point in one direction, implying that even though Steve Jobs is dead, Apple ain’t. It hasn’t lost its mojo. Hold that thought for now.

It’s important to note that releasing the first three-day sales data of any product is not something Apple has done before. Apple CEO Tim Cook’s said in a statement that sales had been “the best first weekend sales ever in China.”

Its stock having fallen more than 25 percent in the last three months, Cook must have felt compelled to say something after negative publicity started to swirl last week focusing on nearly empty Apple stores in China during the launch of iPhone 5.

Let’s demystify a few things about Apple and China.

1. Customer traffic in Apple stores --- there are seven in China – isn't the sole measure of the Chinese consumers’ appetite for iPhones.

After all, Apple instituted an online lottery system to allot sales in order to defeat those who buy and then resell iPhones. In other words, the long queues that symbolize new Apple products were not there simply because Chinese customers aren’t allowed to buy an iPhone without a reservation.

2. Sales of iPhones in China, heavily subsidized by cellular operators, are tightly coupled with mobile carriers’ subscription contracts.

Shanghai Daily reported over the weekend that China Telecom was expecting to sell 10,000 phones on the first day of the launch, while China Unicom said it had sold 5,000 by noon last Friday. There are, however, no comparative figures available for sales by these operators. Such figures require a note of caution: No one knows how much better iPhone 5 has done in initial sales compared to previous iPhones.

3. It's misleading to say iPhones are too expensive for Chinese consumers.

Yes, unsubsidized iPhones are expensive (starting at $846), but an iPhone 5 with subscription contract could go for as little as $96 in China.
Next: China Mobile, Apple talks
TAG:Apple China iPhone 5

山东民间玉器收藏走热

山东民间玉器收藏走热


  中新网济南12月17日电 (记者 孔凡元)“山东民间玉器收藏者多,并呈现出明显的‘走热’态势,对于鉴定和收藏,此间民众趋之若鹜,但大众收藏的藏品普遍价值不高.一般的收藏虽然有些老品,但普遍档次不高,属于民间一般收藏,精品甚少.”文化部中国玉文化研究会会长侯彦成17日在接受中新社记者采访时如是说.

  由文化部中国玉文化研究中心主办的“书香・玉韵・君子风――― 中国古玉精品展”12月8日至28日在山东省图书馆举办.连日来,来自山东各地的民众怀抱收藏玉器珍品,排着长队等待专家给予鉴定.

  侯彦成说,在他在此间做鉴定的几天时间内,只有少数藏品让他感到惊喜,如辽金时期的炉鼎等就很有收藏价值.

  侯彦成认为,玉的收藏,心态最重要,收藏“玉”,不要仅仅局限于其本身价值,更应关注玉器背后的艺术价值和文化内涵.在他看来,“和”是玉文化的本质,“玉”是美好、和谐、仁爱的象征.“大象无形”、“老子出关”等玉器精品,每一件玉器都是在弘扬一种文化,寄托一种情感,表达一种思想.

  侯彦成认为,收藏者切记对着书本中玉器的造型购买玉器,要请教专家或行家收藏者,要多走进博物馆,尤其是多深入了解科学考古出土的玉器文物.真正提高眼界,减少盲目性,有目的有针对性的低风险的收藏玉器.

  记者从鉴定现场看到,众多民众对古玩玉器有着很高的热情.民众纷纷带着自己的藏品,期待专家给自己一个“鉴定”.赶来参加此次古玉鉴定的泰安藏家王有才说,他收藏了一个汉代的“玉镯”,是祖传的,特意赶来让专家鉴定,专家鉴定是真的,很高兴.下一步会考虑购买一些玉器收藏.

  文化部中国玉文化文化研究中心副主任李新生表示,文物大省山东各地有众多古玩市场,但高端玉器市场非常罕见.大多数是鱼目混珠的小摊贩集市,他指出,山东玉器市场需要进一步规范,筹建合法权威的专业性鉴定机构,探索一条玉文化的市场之路和投资之路.




来源:新浪收藏


TAG:山东民间玉器收藏走热 翡翠 翡翠手镯 中国翡翠网 翡翠新闻

2012-12-17

Slideshow: Top ten shifts in chips, comms

Slideshow: Top ten shifts in chips, comms


SAN JOSE, Calif. – It was a tough year. When it was all over, the semiconductor industry contracted about four percent, according to market watchers who spent much of the year revising their forecasts downward.

Much of the blame belongs to Europe. Greece, Spain, Italy and Ireland took turns threatening a fiscal collapse that could pull down the European Union with it. The U.S. struggled through a sluggish recovery as it watched. Even the big bull and global growth engine of China pulled in its horns, expecting a storm.

A summary follows.


Click on image to enlarge.

Next: Shift to mobile cloud
TAG:2012 Semiconductors Communications Recovery Economy Mobile Cloud SDN Intel ARM AMD China Microsoft Elpida Apple Samsung Otel

Qualcomm, Broadcom climb in chip company ranking

Qualcomm, Broadcom climb in chip company ranking


LONDON – Although 2012 is not quite over, market research firm Gartner reckons it can already state that the global chip market will decline by 3 percent in 2012 to $297.6 billion with the top 25 vendors generating 68.2 percent of the total.

As a result of the weakness its perceives in 2012 Gartner now forecasts that the industry will show little growth in the first half of 2013 but that the second half would see a recovery phase.

Steve Ohr, a research director at Gartner, said that the PC business, ordinarily a growth driver, was a declining market in 2012 for the first time in many years. "PC production declined 2.5 percent in 2012. Even the smartphone juggernaut had begun to show signs of maturing, though it remained the strongest driver for revenue growth in 2012," Ohr said.

Intel is set to record a 2.7 percent revenue decline, mostly due to declining PC sales, according to Gartner analysts. Samsung in second place is likely to have declined even faster, by 8.7 percent, mainly due to weakness in memory pricing. The only two companies to achieve revenue growth in the semiconductor top ten are likely to be third-placed Qualcomm, growing by 29.6 percent to about $12.95 billion and 9th placed Broadcom with an 8.8 percent expansion of sales to about $7.8 billion.



Click on image to enlarge.


Top ten semiconductor vendors by revenue, worldwide, 2012 ($-millions). Source: Gartner



Related links and articles:

Chip market rebound coming, survey says

Chip market to fall in 2012, rise in 2013

Report: Rising GDP set to boost chip markets

Chip firms ranked by Q4 guidance




TAG:SK Hynix Texas Instruments Intel Samsung Qualcomm Toshiba Renesas STMicroelectronics Broadcom Micron Gartner semiconductor

Imagination raises MIPS bid

Imagination raises MIPS bid


LONDON – The bidding war between graphics IP licensor Imagination and DSP IP licensor Ceva for MIPS Technologies Inc. has reached $100 million. MIPS is a long-established licensor of processor architectures and IP.

Imagination Technologies Group plc (Kings Langley, England) has raised for a second time to try and outbid Ceva Inc. (Mountain View, Calif.) which had previously bid $90 million.

Imagination started the process in early November with a bid of $60 million to buy MIPS's operating business and certain patents while another U.K. company, ARM Holdings plc (Cambridge, England), would lead a consortium called Bridge Crossing that would acquire rights to the major part of the MIPS portfolio of patents as a form of legal protection. Bridge Crossing is set to pay $350 million in cash to purchase the rights to the MIPS portfolio, of which ARM will contribute $167.5 million.

Imagination said on Dec. 17 that is has signed a revised agreement to acquire the operating business, certain patent properties and license rights to the rest of the patent properties of MIPS Technologies Inc. for $100 million in cash. All the other terms and conditions of the acquisition are the same as the previous bids, Imagination said.

Imagination added that the acquisition would be financed from existing cash resources and an acquisition facility that has been set up. The deal is expected to close in the first quarter of 2013.


Related links and articles:

Ceva rebids for MIPS to stretch Imagination

Imagination raises bid for MIPS

Ceva bids for MIPS

ARM, Imagination divide up MIPS

Handicapping the field of possible MIPS suitors






TAG:Imagination MIPS Ceva ARM IP processor graphics DSP semiconductor

Lithography experts remain skeptical about EUV

Lithography experts remain skeptical about EUV


It was the end of the semiconductor roadmap for 193-nanometer lithography--the next generation would have to go to 157-nanometer light.

Jim Blatchford, Texas Instrument's manager of front-end processing, had just finished negotiating for a leading edge 157-nanometer photolithography system, but he was still worried about the unproven technology, so he went to an SPIE (Society of Photo-Optical Instrumentation Engineers) session on 157-nanometer lithography.

When he arrived, however, he was surprised to find the room nearly empty. The rain was pouring down outside making a lonley pitter patter without the usual crowd noises to mask it. Something was wrong at 157-nanometer.

"I remember it so well. We had just finished negotiations on our 157-nanometer tool, but when I walked into a 157-nanmoter session at SPIE 2004 the room was almost completely empty. The sound of the rain pouring down on the roof was eery. I knew right away that something was wrong," said Blatchford.

The mystery was solved when Blatchford found out that the attendees were crowded into the immersion lithography session for 193-nanometer, where presenters were claiming that engineers didn't need to risk going to 157-nanometer. All they had to do was immerse the reduction lens nearest the wafer in water to decrease feature sizes by its index-of-refractionn (1.44). And with higher index fluids, it should be possible to extend 193-nanometer lithography evern further.

"What was most surprising to me was just how quickly everyone adopted immersion lithography. Once it was established as a feasible technology, everybody got on-board immediately," said Blatchford.


Click on image to enlarge.

Light at 193 nm has a resolution limit on the order of 65 nm, but immersion lithography uses the same light source and yet realizes a semiconductor process at precisions as high as 40-45nm. (Source: Nikon)


TAG:Extreme Ultraviolet Lithography Texas Instruments EUV

John McCollum: HS teacher taught electronics with love

John McCollum: HS teacher taught electronics with love


Like most schools in Silicon Valley, Homestead High – alma mater to Apple founders Steve Jobs and Steve Wozniak -- offered students a plethora of elective classes to round out their mandatory curriculum. While autoshop and woodwork were both popular choices, one elective in particular sparked the creative interest in Cupertino’s kids, and that was John McCollum’s electronics class.

A retired navy pilot, McCollum was a serious, white shirt, white tie kind of teacher, with a passion for nurturing young talent.

“He didn’t go by the rules most people go by as teachers” said Steve Wozniak. Bill Fernandez, Wozniak’s younger neighbor and introductory link to Steve Jobs described McCollum as a “very straightforward” teacher who “insisted on a reasonable amount of discipline in the class.”

Writing his own course material, McCollum used a highly practical approach to electronics, expecting every child to use a slide ruler and be adept at scientific notation. He also ensured that oscilloscopes and other equipment peppered every workbench in the room, most of which originated from McCollum’s scavenger hunts across the valley.

“He had a great lab. The high school was very well equipped. Metal shop, wood shop, auto shop and a little TV studio,” Fernandez recalled, noting that McCollum kept his electronics Alladin’s cave locked from prying eyes and grabbing hands.

"I don’t know that I ever got to go in there but I knew he had a place where he kept all the parts that we used. Then there was an area in the corner of the room where there were large bins that were for surplus electronics. It was open season on that. We grabbed things and tore parts off to use them in our projects,” he said.

“I learned such valuable things in his class. The learning got through to me so well. It all made sense. Everything we learned about in that electronics class, we built,” said Wozniak, proudly, adding that it had been McCollum who first encouraged his love of practical jokes.

“We built things that you could really show off. We learned [things] that gave me a lot of insight into pranks I could play on people who didn’t know electronics,” he said.

Such pranks included building devices like a police siren, using circuitry, a battery and mini speaker or TV jammers, which were Fernandez’s specialty.

“I was really good at making them small and compact. A little cube shaped circuit that would plug on top of a single battery, with a little antenna. It could be used to jam out TV signals. When we were making TV jammers, I made the best one,” he said.

Indeed, so good was Fernandez’s jammer that when he left for Colorado state university, Wozniak took one with him, which he used to mercilessly terrorize fellow dorm members, making them contort into all kinds of shapes in front of the jammed TV before releasing the signal, fooling them into thinking their body position had cleared the picture.

“John McCollum loved jokes and he loved whenever students played jokes,” said Wozniak.

McCollum’s love of childish pranks, however, did not extend into a love of youth culture music, with another student from the early 1970’s noting the teacher’s visceral hatred for the synthesized sounds of musicians like Jimi Hendrix.

“We learned about distortion and how horrible the rock musicians music was with all the distortion. I remember that being discussed in class,” said Don Nelson, a 1972/3 alumni of McCollum’s course.
“He was very focused on the technology, I don’t recall him being an entertainer. Some teachers would be more like entertainers, keep the kids laughing and tell all kinds of stories. He was all business,” said Nelson, describing McCollum as “a very conservative, older guy.”

Indeed, McCollum was a divisive figure, respected and revered by students, but disliked by many of his professional colleagues who found him somewhat overbearing.

“McCollum was such a talker that most of us would walk out of prep period meetings with the principal if he was in attendance,” recalled Larry Vosovic, a former English teacher at the school, noting that McCollum “would digress and dominate the discussion.”

McCollum’s single-mindedness, however, seemed to spring from the attitude that electronics was a way of life. So much so, in fact, that as a teacher he would go to great lengths to secure internships in local companies for his students.


Click on image to enlarge.

Steve Jobs (far right) in John McCollun's pioneering electronics class.

TAG:John McCollum

蛇年蛇造型珠宝大赏

蛇年蛇造型珠宝大赏

  蛇是带有攻击性的生物,在众人眼中并非美好之意。然而蛇也是颇具灵性的生物,古时便有将灵蛇比喻才华横溢之人的说法。这些看似凶猛的灵兽,在珠宝设计师眼里却宛若蛟龙,凭借高超的珠宝工艺,将他们塑造成项链、指环、耳环等精美首饰,佩戴之余也有征服猛兽的胜利感吧,在即将到来的2013蛇年,蛇形珠宝想必也会大热一把。




TAG:珠宝 蛇形 项链 指环 蛇年蛇造型珠宝大赏

2012-12-16

甜蜜圣诞给TA的暖心珠宝

甜蜜圣诞给TA的暖心珠宝

  悄悄拿出为TA准备好的圣诞礼物放入红色的袜子吧,等待第二天接受最爱的TA的欣喜与赞许,紧紧相拥,让喜悦定格在漫天飞舞的雪花中。这里甄选了十几款圣诞情侣礼物,与你一起见证属于你们的浪漫时刻!




TAG:珠宝 爱意 圣诞 礼物 甜蜜圣诞给TA的暖心珠宝

Altera eyes FDSOI process for FPGAs

Altera eyes FDSOI process for FPGAs


LONDON – A senior engineer at FPGA vendor Altera has evaluated fully-depleted silicon on insulator (FDSOI) chip process technology and concluded that the technology could have particular benefits for FPGAs. This raises the possibility that Altera could be considering replacing Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan) as its foundry manufacturing partner or operating a dual-foundry manufacturing strategy in the future.

Jeff Watt, an Altera fellow and technology development specialist, presented An evaluation and benchmarking of 14-nm fully-depleted technology for FPGAs at a symposium on FDSOI held alongside the International Electron Devices Meeting.

Altera is reported to be engaged with TSMC at the 20-nm bulk planar CMOS node due to ramp in 2013 but concerns have been raised that the node will be power hungry. Grenoble research institute Leti, SOI wafer maker Soitec and IBM have been ST's partners in the development of the FDSOI process, and ST has added a licensing deal with Globalfoundries Inc. (Milpitas, Calif.) that could increase manufacturing capacity. TSMC is not known to be working on FDSOI but has indicated a rapid switch to a 16-nm FinFET as its next-generation technology in 2014.

In his presentation Watt concluded that planar FDSOI has advantages for ICs in general but has particular benefits for FPGA circuits. His presentation made comparisons between bulk planar CMOS at 28-nm and FDSOI planar CMOS at 14-nm suggesting that Watt has adopted the convention that the next FDSOI node after 28-nm should be labeled 14-nm FDSOI (see FDSOI roadmap renames next node as 14-nm).

Watt said in his presentation that 14-nm FDSOI could give a 35 percent performance improvement compared with 28-nm bulk planar CMOS at the same switching power or a 32 percent lower switching power at the same delay time. Watt also showed how the use of body bias to effect power/delay trade-off customization over a wide range could be attractive to the FPGA maker.

Altera's interest could be a possible fall out of supply problems experienced by customers of 28-nm bulk CMOS manufacturing at TSMC earlier in 2012. There was speculation at that time that Altera might turn to Intel as a foundry supplier that could offer leading-edge FinFET manufacturing process technology. If Altera does opt for FDSOI it would likely be supplied by Globalfoundries as ST only has pilot line capability at its wafer fab in Crolles.

TSMC has reportedly secured large orders for FPGAs to be made using next-generation 20-nm bulk planar CMOS from both Altera and its rival Xilinx. Altera was rumored to be the first company to commit to TSMC's 20-nm planar bulk CMOS process, which is expected to ramp in 2013. In addition both Altera and Xilinx are thought to be interested in multi-chip packaging using TSMC's CoWoS (chip on wafer on substrate) process but TSMC has yet to begin volume production of 20-nm.

However, a dual-foundry manufacturing strategy could create difficulties for Altera. One of the benefits of staying loyal to one foundry is early access to process technology, something that is vital to FPGA vendors. There could be concerns that TSMC would provide better support and access to the customer that is 100 percent loyal.


Related links and articles:

Full slide decks from FDSOI symposium available at:

www.soiconsortium.org

News articles:


FDSOI roadmap renames next node as 14-nm

London Calling: Could gate-switched FDSOI win?

28-nm FDSOI is production ready, says ST


Next: Selected slides from Jeff Watt's presentation
TAG:Altera TSMC STMicroelectronics Globalfoundries FPGA FDSOI manufacturing process

IBM provides Russia with 90-nm process

IBM provides Russia with 90-nm process


LONDON – IBM Coirp. has agreed to help Russia's Angstrem with 90-nm manufacturing process as part of a broader agreement on collaboration that will range from mathematics to microelectronics and computer science.

OJSC Angstrem (Zelenograd, Russia) said it intends to use the 90-nm process to make ICs and sensors for industrial and consumer applications. In addition, Angstrem will receive design rules and support to help it set up as a foundry operation to serve Russian and external customers, the company added. The deal is being funded by the State Corporation Bank for Development and Foreign Economic Affairs (Vnesheconombank) and the process will be installed in a newly-built factory in Zelenograd, known as Angstrem-T.

The amount that Angstrem is paying to IBM was not disclosed.

In addition to the licensing agreement, the two companies have signed a memorandum of understanding that outlines areas of potential future cooperation around the use of the technology. Under the terms of the MoU areas of possible partnership between Angstrem and IBM include: chemistry, electrical engineering, computer science, materials science, mathematics, physics and microelectronics.

"IBM's advanced technologies in microelectronics - the primary sector of the innovation economy - will help to accelerate the development of innovations in other related industries," said Alexey Litvinov, general director of Angstrem, in a statement.

"Technological innovation has a huge role to play in Russia's economic development and in improving the quality of life by increasing access to new technologies, systems and devices," said Siamak Kia, of the IBM Research & Intellectual Property Executive, in the same statement. Kia added: "I expect the next logical step in this partnership to be microelectronics packaging technologies to further expand and deepen the growing relationship."


Related links and articles:

www.angstrem.ru

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TAG:IBM Angstrem Mikron manufacturing process semiconductor MEMS sensors

2012-12-15

Chip market rebound coming, survey says

Chip market rebound coming, survey says


LONDON – A chip market rebound will help the U.S. move head of China as the most important market for revenue according to a global survey of semiconductor executives conducted by business consultancy KPMG.

The rebound is likely to begin in the second half of 2013, but 75 percent of the 152 executives polled said their companies' revenue growth will increase in the next fiscal year, compared to 63 percent a year ago. Also, two-thirds expect their workforce to expand, up from just 48 percent in last year's survey and 71 percent say annual industry profitability will increase over the next year.

The survey was conducted in September 2012 and the senior level executives polled were drawn from IDM, foundry and fabless chip companies.

The U.S. is growing in significance for the third year in a row, and fewer industry executives believe China will be the most important market for their company's semiconductor revenue growth three years from now. Executives said the U.S. will be the most significant market, followed by China and Europe, South Korea and Taiwan, KPMG said. Two years ago Taiwan was ranked second, ahead of the U.S.

In terms of growth of employment over the next 12 months China remains the leader. Significantly, fewer executives placed China among the top three markets for job growth during the next 12 months in this year's survey, while more placed the U.S. and Europe at the top.

Consumer electronics replaced wireless devices in the survey as the top semiconductor application, which may reflect the stranglehold achieved on the wireless device category by the likes of Apple and Samsung. More executives ranked industrial, medical, automotive and power management as important revenue drivers than in the previous three year's surveys, KPMG said.

This year, 53 percent of the executives said renewable energy technologies like batteries will be an important driver of revenue over the next three years, up from 36 percent a year ago.
Next: More deals in 2013
TAG:Chip market KPMG survey CEO semiconductor China confidence

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TAG:珠宝 施华洛世奇 元素 圣诞新年 施华洛世奇圣诞新年精品推荐

Apple could ship 100M iPads in 2013

Apple could ship 100M iPads in 2013


MANHASSET, N.Y. -- The iPad continues to dominate the tablet market, and at least one analyst forecasts the possibility of Apple shipping 100 million iPads in 2013.

IDavid Hsieh, vice president at NPD DisplaySearch, blogged: “In 2013, it is likely that Apple will adjust its product portfolio to meet the strong demand for the iPad mini. We believe that Apple is targeting total iPad shipments of 100 million in 2013, half accounted for by the iPad mini, and 40 million new iPad and 10 million iPad 2, as production continues at least until the middle of 2013.”

While the new iPad was originally planned to replace the iPad 2, strong sales of the legacy model have continued, and panel makers have adjusted new iPad panel production downward while maintaining production of iPad 2 panels.

The iPad mini was voted one of the hottest consumer products of 2012 in Japan, but immediately faced supply shortages for its 7.85” XGA display supplied by AUO and LG Display. Hsieh said Apple planned to sell 6 million units in 2012 but only 1.6 million panels shipped in Q3’12.

Apple is asking panel makers to ship more than 12 million unit in the fourth quarter to fulfill the strong demand, according to Hsieh.

The iPad panels need to operate at a high resolution and at low power consumption. That, together with the wide viewing angle and high color saturation specifications, requires as many as eight mask steps in the display manufacturing process, which translates to longer production times and lower yield rates.

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Next: Portfolio adjustment
TAG:Apple IPad

Chip sales slide in Q4 amid inventory, pricing gloom

Chip sales slide in Q4 amid inventory, pricing gloom

SAN FRANCISCO--A major industry analyst firm sounded alarm on globalIC sales Friday (Dec. 14), citing falling fourth quarter revenue forchip vendors, relentless price pressure and stubbornly highinventories.

"Fears abound that industry revenue could decline even more thancurrently predicted in the fourth quarter, if economic conditions donot improve," IHS said in its regular Semiconductor Manufacturing& Supply Market Tracker Report.

"The complete reversal in growth is indicative of how distressingconditions have become for the industry, and the downward pressureon sales has not eased," IHS said.

Q4 semiconductor revenue is forecast to fall by 0.7 percent comparedto the third, which will pull 2012 overall performance down fartherto a projected annual decline of 2.3 percent to $310 billion. Thesemiconductor industry in 2011 rose 1.3 percent by contrast.

“The global economy continues to be the most critical variableaffecting the semiconductor space both this year and the next,especially because the chip industry is highly dependent on consumerspending,” said Len Jelinek, director and chief analyst ofsemiconductor manufacturing at IHS. “And until consumers believetheir financial position is stable or improving, consumer spendingwill likely remain soft.”

IHS said December will be lackluster months as anticipated holidaysystem sales have already been made. In the near term, no majorIC-sales drivers are evident, IHS added.

The IHS also report emphasized its concern over high inventorylevels.

"Given the excess inventory, end-equipment manufacturers have beendelaying the placement of orders for additional components. Theresult on the whole is that chip suppliers aren’t running theirmanufacturing operations optimally, and also are manufacturingproducts solely based on historical demand," IHS said.

The report did offer a ray hope among what it termed a "fragilegrowth scenario." Supply and demand should even out in the firstquarter of 2013, and silicon shipments are forecast to rise near theend of that period, IHS said.


TAG:semiconductors IHS forecast electronics market research

Aldec supports ARM Cortex-A9 in HES-7 ASIC prototyping platform

Aldec supports ARM Cortex-A9 in HES-7 ASIC prototyping platform

The folks at Aldec tell me that they now support ARM dual-core Cortex-A9 MPCore application development and verification in their HES-7 ASIC prototyping platform.

The HES-7 leverages the Xilinx Virtex-7 2000T All Programmable FPGA and the Zynq-7000 All Programmable SoC, and it includes peripherals supporting media interfaces, memories, and additional connectors to expand the development of a wide array of SoC applications.

The HES-7 ASIC prototyping platform – coupled with open-source Linux, Android, and FreeRTOS solutions available from Xilinx – provides software developers of ARM Cortex-A9 applications with a complete SoC platform. These applications, along with the 4 to 96 million ASIC gate scalable capacity of HES-7, deliver a powerful verification platform for design teams comprised of hardware and software engineers.

Leverage Cortex-A9
Designers can now leverage the serial processing capabilities of the Cortex-A9 processor for applications that require intensive computations and operating systems with the parallel processing capabilities of HES-7 ASIC prototyping platform to create applications across a diverse range of markets including: Video, Communications, Control Systems and Bridging.


TAG:Aldec ARM Cortex A9 HES 7