ARM, HP, SK Hynix join Hybrid Memory Cube group

ARM, HP, SK Hynix join Hybrid Memory Cube group

LONDON – ARM, Hewlett-Packard and SK Hynix have joined the Hybird Memory Cube Consortium (HMCC) led by Micron and Samsung, a sign of gathering momentum for this proposed application of 3-D memory stacks.

The three companies, which have technology expertise in processors, computers and memory, join Altera, IBM, Microsoft, Open-Silicon, Xilinx as well as Micron and Samsung working to draft an open interface specification for stacked memory.

One of the motivations for forming the HMCC is that the memory bandwidth required for next-generation high-performance computers and networking equipment has increased beyond what conventional memory architectures can provide. Breaking through the "memory wall" will require increased density and bandwidth at reduced power consumption, a goal of HMCC.

HMCC plans to deliver a final interface specification by the end of 2012.

"With the addition of ARM, HP and SK hynix as developers, who will help to determine the specific features, the consortium is well positioned to provide a new open standard for next-gen electronics," said Robert Feurle, Micron's vice president for DRAM marketing, in a statement.


Related links and articles:

www.hybridmemorycube.org

News articles:

Microsoft joins Micron memory cube effort

Micron broadening support for memory cube

IBM, Micron to build hybrid memory with TSVs

Micron, Samsung seek hybrid memory specification


TAG:Hybrid Memory Cube SK Hynix ARM HP Micron Samsung semiconductor HMCC DRAM memory stacked

Scientists to push organic solar cell efficiency

Scientists to push organic solar cell efficiency

PARIS – Researchers from the Karlsruhe Institute of Technology (KIT) have launched a four-year research program that aims to improve the efficiency of organic solar cells to more than 10 percent.

Organic solar cells are cheaper to produce, lighter and more flexible than traditional silicon-based solar cells, opening new perspectives in particular for the architectural design of buildings. Solar modules can be integrated in facades and even windows. The downside is that the efficiency rate of OPV cells remains much lower than inorganic solar cells, demonstrating 15-20 percent efficient.

Led by Dr. Alexander Colsmann, at KIT's Light Technology Institute, the newly-launched project uses tandem architectures. Two solar cells with complementary absorption characteristics are stacked directly on top of each other to achieve better sunlight harvesting and more efficient energy conversion.

The KIT scientists said they use novel materials, develop innovative device architectures, optimize their stability, and test the solar cells in a real-life environment. They also intend to transfer manufacturing processes from the laboratory to an industry-compatible production environment so as to promote future commercial use of their results.


Source KIT

TAG:Karlsruhe Institute of Technology Solar Cells Efficiency Organic OPV

Xilinx to recruit engineers in $50 million Irish expansion

Xilinx to recruit engineers in $50 million Irish expansion

FPGA vendor Xilinx is to invest $50 million to expand its operations at its European headquarters in Dublin and Cork, Ireland, recruiting 60 silicon designers and applications engineers.

The company will recruit 45 senior silicon and electronics engineering staff for its regional headquarters in Dublin and for its engineering centre in Cork as well as a further 15 staff across a broad range of disciplines supporting the continued growth of Xilinx in Ireland.

Xilinx currently employs over 250 at its EMEA headquarters and the investment will support development work for advanced technologies and products where the Irish arm already works with Xilinx's Programmable Platforms Group (PPG) in California on 7 series FPGAs, Zynq-7000 SoCs, Virtex-7 3D ICs and the Vivado Design Suite.

"We're very pleased with this investment, which endorses the quality of advanced engineering and product development work being undertaken by Xilinx Ireland where everyone is an important contributor to the global success of the corporation," said Kevin Cooney, managing director of Xilinx in Europe. "This expansion will provide a range of valuable career development opportunities for experienced engineers, as we continue to fulfil our strategic development responsibilities in Ireland. At the same time, it’s symbolic of our steadfast commitment to pioneering all-programmable technology innovation – far beyond our programmable logic roots – aimed at increasing customer value and expanding our reach to a broad base of design engineers and system architects."

Xilinx first established operations in Dublin in 1995, subsequently building and expanding operations on its own campus. In 2001 it also invested over 50 million euro (about $60 million) in an expansion of its Dublin facilities as the company’s EMEA headquarters. In 2005 it established an offshoot of Xilinx Research Labs in Dublin and in 2011 it acquired the Belfast-based telecommunications technology firm Omiino.


Related links and articles:

Intel confirms Ireland for 14-nm silicon

Movidius signs $25 million Chinese partnership deal

Xilinx to demo all-programmable OTN solutions


TAG:Xilinx Ireland Cork Dublin jobs

Xilinx to recruit engineers in $50 million Irish expansion

Xilinx to recruit engineers in $50 million Irish expansion

FPGA vendor Xilinx is to invest $50 million to expand its operations at its European headquarters in Dublin and Cork, Ireland, recruiting 60 silicon designers and applications engineers.

The company will recruit 45 senior silicon and electronics engineering staff for its regional headquarters in Dublin and for its engineering centre in Cork as well as a further 15 staff across a broad range of disciplines supporting the continued growth of Xilinx in Ireland.

Xilinx currently employs over 250 at its EMEA headquarters and the investment will support development work for advanced technologies and products where the Irish arm already works with Xilinx's Programmable Platforms Group (PPG) in California on 7 series FPGAs, Zynq-7000 SoCs, Virtex-7 3D ICs and the Vivado Design Suite.

"We're very pleased with this investment, which endorses the quality of advanced engineering and product development work being undertaken by Xilinx Ireland where everyone is an important contributor to the global success of the corporation," said Kevin Cooney, managing director of Xilinx in Europe. "This expansion will provide a range of valuable career development opportunities for experienced engineers, as we continue to fulfil our strategic development responsibilities in Ireland. At the same time, it’s symbolic of our steadfast commitment to pioneering all-programmable technology innovation – far beyond our programmable logic roots – aimed at increasing customer value and expanding our reach to a broad base of design engineers and system architects."

Xilinx first established operations in Dublin in 1995, subsequently building and expanding operations on its own campus. In 2001 it also invested over 50 million euro (about $60 million) in an expansion of its Dublin facilities as the company’s EMEA headquarters. In 2005 it established an offshoot of Xilinx Research Labs in Dublin and in 2011 it acquired the Belfast-based telecommunications technology firm Omiino.


Related links and articles:

Intel confirms Ireland for 14-nm silicon

Movidius signs $25 million Chinese partnership deal

Xilinx to demo all-programmable OTN solutions


TAG:Xilinx Ireland Cork Dublin jobs

Report: TSMC's Chang says no to buying Renesas fab

Report: TSMC's Chang says no to buying Renesas fab

LONDON – Morris Chang, chairman of foundry Taiwan Semiconductor Manufacturing Co. Ltd., has said his company has no intention of acquiring a wafer fab from struggling Japanese chipmaker Renesas Electronics Corp., according to a Focus Taiwan news report.

It was recently reported in Japan that Renesas was in negotiations with TSMC that, as well as increasing TSMC's role as a foundry supplier of microcontrollers to Renesas would see it take over a wafer fab in Yamagata and take over the employment of roughly 1,400 employees there.

The move would have been part of massive re-organization that could see Renesas close or sell more than half its domestic factories and trim its workforce by about 12,000 people or 30 percent.

Renesas has been making losses since its formation in 2010 as a joint venture that brought together the chip making interests of Hitachi, Mitsubishi Electric and NEC. On Tuesday (July 3) the company announced some details of its restructuring including offers to workers to take early retirement or to leave the company for about 5,000 workers. However, plans to trim the company's market engagement and to increase the outsourcing of manufacturing were vague.

Chang said he expects TSMC to provide more advanced chip production to TSMC but that the acquisition of the wafer fab was not on TSMC's agenda, the report said.

In May the two companies announced that they had agreed to extend microcontroller technology collaboration to include 40-nm embedded flash process technology and that in addition TSMC will be able to make the MONOS (Metal-Oxide-Nitride-Oxide-Silicon) embedded flash platform available to other customers.


Related links and articles:

White knight or asset stripper?

Renesas seeks $620 million from KKR, says report

Report: Renesas Mobile up for sale in re-org

Renesas extends MCU work with TSMC to 40-nm

Reports: Renesas to tie up with TSMC, cut jobs

TAG:Morris Chang TSMC Renesas semiconductor foundry MCU jobs fab

Report: TSMC's Chang says no to buying Renesas fab

Report: TSMC's Chang says no to buying Renesas fab

LONDON – Morris Chang, chairman of foundry Taiwan Semiconductor Manufacturing Co. Ltd., has said his company has no intention of acquiring a wafer fab from struggling Japanese chipmaker Renesas Electronics Corp., according to a Focus Taiwan news report.

It was recently reported in Japan that Renesas was in negotiations with TSMC that, as well as increasing TSMC's role as a foundry supplier of microcontrollers to Renesas would see it take over a wafer fab in Yamagata and take over the employment of roughly 1,400 employees there.

The move would have been part of massive re-organization that could see Renesas close or sell more than half its domestic factories and trim its workforce by about 12,000 people or 30 percent.

Renesas has been making losses since its formation in 2010 as a joint venture that brought together the chip making interests of Hitachi, Mitsubishi Electric and NEC. On Tuesday (July 3) the company announced some details of its restructuring including offers to workers to take early retirement or to leave the company for about 5,000 workers. However, plans to trim the company's market engagement and to increase the outsourcing of manufacturing were vague.

Chang said he expects TSMC to provide more advanced chip production to TSMC but that the acquisition of the wafer fab was not on TSMC's agenda, the report said.

In May the two companies announced that they had agreed to extend microcontroller technology collaboration to include 40-nm embedded flash process technology and that in addition TSMC will be able to make the MONOS (Metal-Oxide-Nitride-Oxide-Silicon) embedded flash platform available to other customers.


Related links and articles:

White knight or asset stripper?

Renesas seeks $620 million from KKR, says report

Report: Renesas Mobile up for sale in re-org

Renesas extends MCU work with TSMC to 40-nm

Reports: Renesas to tie up with TSMC, cut jobs

TAG:Morris Chang TSMC Renesas semiconductor foundry MCU jobs fab

A Hitchcockian nightmare: Europe falling off a cliff

A Hitchcockian nightmare: Europe falling off a cliff

Europe's monetary and debt woes are now clearly having an effect on its ability to do business – which is a yet more frightening prospect, than the crisis we are already living with.

Because without the ability to do business Europe cannot even continue to generate the value it currently does and which it already overpays itself for in its aggregate life style.

It may seem an apocalyptic view but there is the evidence in the latest numbers from the World Semiconductor Trade Statistics, published by the Semiconductor Industry Association.

Globally the situation is not good with semiconductor sales in March, April and May (which are represented by the three-month average ascribed by the SIA to May) generally down. The Asia-Pacific region is down 1.9 percent on the same period in 2011. The Americas region is down 3.2 percent. Japan is up 0.4 percent.

But look at this, the European region is down 13.6 percent compared with a year before. In global statistics terms that is a major percentage change. The equivalent figures in March and April were 15.4 percent and 14.4 percent. Basically it appears that in 2012 Europe's drawn-out financial woes are driving a significant chunk of business out of the continent.

It is likely that startup businesses are not happening, particularly in such countries as Greece, Portugal and Spain. Similarly inward investors are putting any plans they have on hold. "Let's not open up in Europe right now, best to see how the dust settles." And multinational companies are likely to be shifting their weight off their European foot and on to another, most likely in the Asia-Pacific region.
Next: Europe's chip market steps down
TAG:Alfred Hitchcock Europe Germany

A Hitchcockian nightmare: Europe falling off a cliff

A Hitchcockian nightmare: Europe falling off a cliff

Europe's monetary and debt woes are now clearly having an effect on its ability to do business – which is a yet more frightening prospect, than the crisis we are already living with.

Because without the ability to do business Europe cannot even continue to generate the value it currently does and which it already overpays itself for in its aggregate life style.

It may seem an apocalyptic view but there is the evidence in the latest numbers from the World Semiconductor Trade Statistics, published by the Semiconductor Industry Association.

Globally the situation is not good with semiconductor sales in March, April and May (which are represented by the three-month average ascribed by the SIA to May) generally down. The Asia-Pacific region is down 1.9 percent on the same period in 2011. The Americas region is down 3.2 percent. Japan is up 0.4 percent.

But look at this, the European region is down 13.6 percent compared with a year before. In global statistics terms that is a major percentage change. The equivalent figures in March and April were 15.4 percent and 14.4 percent. Basically it appears that in 2012 Europe's drawn-out financial woes are driving a significant chunk of business out of the continent.

It is likely that startup businesses are not happening, particularly in such countries as Greece, Portugal and Spain. Similarly inward investors are putting any plans they have on hold. "Let's not open up in Europe right now, best to see how the dust settles." And multinational companies are likely to be shifting their weight off their European foot and on to another, most likely in the Asia-Pacific region.
Next: Europe's chip market steps down
TAG:Alfred Hitchcock Europe Germany

A view from Norway on the Internet of Things

A view from Norway on the Internet of Things

OSLO – Svenn-Tore Larsen is standing in a cramped glass room at the top of Holmenkollen, an Olympic ski jump on the fringe of Oslo. The chief executive is telling a dozen international journalists about the future for Nordic Semiconductor, his small but ambitious chip company.

On one level it’s a bizarre moment in high tech marketing. On another, it’s a perfect metaphor.

In this room with intoxicating views of both a bustling downtown Oslo and the open Norway countryside, Larsen is launching his latest chips, integrated 2.4 GHz RF and ARM Cortex M0 SoCs. He’s telling reporters there’s plenty of room for growth on the consumer wireless frontier they target. He foresees by 2015 a market of “app-cessories” using his chips to link over Bluetooth Low Energy, ANT, proprietary or other wireless protocols to more than a billion handsets and connected TVs that will be shipping by 2015.

Indeed, it’s a stunning view of the next wave of computing and communications full of opportunity. It’s also a bit dizzying. A small company like Nordic could easily tumble and fall prey to forces much bigger than itself.

Giants such as Broadcom and Qualcomm and controller bigwig MicroChip see the growing Internet of Things (IoT) opportunities, too. They are generally pushing broadband Wi-Fi technologies down into lower cost, lower power products, but they also have access to Bluetooth and ANT technology.

Other startups such as Ember Corp. and Dust Networks have staked much of their future on Zigbee or 6LoWPAN protocols. They have been snapped up in the last year by larger Silicon Labs and Linear Technology, respectively, trying to elbow their ways into the more industrial parts of the IoT territory.

For his part, Larsen just wants space to grow a small but comfortable business based in his native Norway. The laid-back CEO left his job as an executive at the Silicon Valley offices of Xilinx to found what is now the only fabless semiconductor company of any significant size in his country.

After the press conference, he lounges with reporters on a rented boat, cruising the local fjords, wearing a company t-shirt and orange tennis shoes, affably answering questions, eating prawns and drinking beer. Larsen is well aware his tiny Norwegian company with just 178 employees and about $140 million a year in revenues has plenty of much-larger competitors who—one way or another--also will want to claim a stake to the IoT territory.

Larsen has watched one-time Bluetooth collaborator, Nokia in neighboring Finland go from a cellphone giant to a shadow of itself in recent years. He also saw in 2005, Texas Instruments snap up Norway’s other small semi company, ChipCon, as part of its IoT bid.

“We are not keen on being a division in a major company,” said Larsen. “We are still in an early stage in this segment, and Bluetooth Low Energy is growing faster than we expected two years ago, so we would like to grow our position,” he said.


Tech journalists gather at the foot of Holmenkollen for the Nordic event.

TAG:Internet Of Things Bluetooth Low Energy Nordic Semiconductor Cortex M0 Wi Fi IoT Nordic Wireless Bluetooth ANT Zigbee RF4CE Protocols ARM Cortex Qualcomm Broadcom Microchip

Memo to Corporate America: 'Skills gap' is closing

Memo to Corporate America: 'Skills gap' is closing

WASHINGTON – Any community college administrator worth his or her salt will tell you how they are addressing the so-called “skills gap” by dispensing with the fluff courses and getting down to brass tacks.

California’s community college system has been at the forefront of the renewed emphasis on skills training through its “stackable credentials” approach that focuses on courses that meet the immediate needs of potential employers.

New York Times columnist Joe Nocera highlights a similar effort called “Year Up” that focuses on matching up poor high school graduates with “middle-skill jobs.” Many of these entry-level jobs start at as much as $40,000 a year, Nocera reports.

These and other efforts across the country illustrate how community colleges have been bending over backwards to address the needs of American corporations. Now it’s time for companies, especially tech companies sitting on piles of cash, to put their money where their mouth has been. The first graduates of these community colleges programs are hitting the job market now.

The fact is that the “skills gap” is fast becoming little more than excuse not to hire new workers. If in fact still exists, U.S. companies must meet the community college system halfway by specifying the skill sets they are looking for.

In California, Van Ton-Quinlivan, vice chancellor for workforce development, told a recent conference that the California community college system is being geared toward delivering the skills companies need. In emerging markets like energy, course credentials include pre- and post-sales certificates for newly minted technical engineers and installers.

The nation’s indispensable community colleges are doing their part to address the skills gap. When will Corporate America begin hiring?

Related story:

Manufacturing by design: New skills needed to compete




TAG:Community Colleges Skills Gap Technical Skills Employment Jobs

Memo to Corporate America: 'Skills gap' is closing

Memo to Corporate America: 'Skills gap' is closing

WASHINGTON – Any community college administrator worth his or her salt will tell you how they are addressing the so-called “skills gap” by dispensing with the fluff courses and getting down to brass tacks.

California’s community college system has been at the forefront of the renewed emphasis on skills training through its “stackable credentials” approach that focuses on courses that meet the immediate needs of potential employers.

New York Times columnist Joe Nocera highlights a similar effort called “Year Up” that focuses on matching up poor high school graduates with “middle-skill jobs.” Many of these entry-level jobs start at as much as $40,000 a year, Nocera reports.

These and other efforts across the country illustrate how community colleges have been bending over backwards to address the needs of American corporations. Now it’s time for companies, especially tech companies sitting on piles of cash, to put their money where their mouth has been. The first graduates of these community colleges programs are hitting the job market now.

The fact is that the “skills gap” is fast becoming little more than excuse not to hire new workers. If in fact still exists, U.S. companies must meet the community college system halfway by specifying the skill sets they are looking for.

In California, Van Ton-Quinlivan, vice chancellor for workforce development, told a recent conference that the California community college system is being geared toward delivering the skills companies need. In emerging markets like energy, course credentials include pre- and post-sales certificates for newly minted technical engineers and installers.

The nation’s indispensable community colleges are doing their part to address the skills gap. When will Corporate America begin hiring?

Related story:

Manufacturing by design: New skills needed to compete




TAG:Community Colleges Skills Gap Technical Skills Employment Jobs

Broadcom extends MIPS deal but does not buy firm

Broadcom extends MIPS deal but does not buy firm

LONDON – MIPS Technologies Inc., a licensor of processor intellectual property that has been reportedly up for sale, has provided long-time customer Broadcom with a multi-faceted, multi-year patent and technology license in return for $26.5 million.

Broadcom (Irvine, Calif.), a leading fabless communications chip company, has been a MIPS licensee since 1998 and was one of the companies that it was thought could make an offer for MIPS (Sunnyvale, Calif.). However, it appears that Broadcom has instead sought to protect itself with an all-encompassing license, one-time deal.

For a payment of $26.5 million Broadcom has obtained non-exclusive worldwide license to patents owned or licensable by MIPS for use with its Broadcom products. In addition it has been granted a multi-year extension of its current MIPS architecture and core licenses that lasts until the last-to-expire of those patents has expired.

"This agreement demonstrates the strength and value of our patent portfolio. In addition, we are pleased that Broadcom, MIPS' largest customer, has extended its license of MIPS' architectures and cores," said Sandeep Vij, CEO of MIPS, in a statement.

MIPS success, and even future existence, may depend on the reception given to the company's lastest product announcement; three families of Aptiv processor cores addressing the low, mid and high ends of the licensible processor core market. The three families are prefixed micro-, inter- and pro- respectively, with initials spelling out MIP and suggesting a Super family yet to come.


Related links and articles:

www.mips.com

News articles:

Handicapping the field of possible MIPS suitors

MIPS challenges ARM's Cortex with Aptiv launch

MIPS introduces Aptiv processor cores

ARM dominates 10 billion unit CPU core market




TAG:Broadcom MIPS processor IP license semiconductor

Broadcom extends MIPS deal but does not buy firm

Broadcom extends MIPS deal but does not buy firm

LONDON – MIPS Technologies Inc., a licensor of processor intellectual property that has been reportedly up for sale, has provided long-time customer Broadcom with a multi-faceted, multi-year patent and technology license in return for $26.5 million.

Broadcom (Irvine, Calif.), a leading fabless communications chip company, has been a MIPS licensee since 1998 and was one of the companies that it was thought could make an offer for MIPS (Sunnyvale, Calif.). However, it appears that Broadcom has instead sought to protect itself with an all-encompassing license, one-time deal.

For a payment of $26.5 million Broadcom has obtained non-exclusive worldwide license to patents owned or licensable by MIPS for use with its Broadcom products. In addition it has been granted a multi-year extension of its current MIPS architecture and core licenses that lasts until the last-to-expire of those patents has expired.

"This agreement demonstrates the strength and value of our patent portfolio. In addition, we are pleased that Broadcom, MIPS' largest customer, has extended its license of MIPS' architectures and cores," said Sandeep Vij, CEO of MIPS, in a statement.

MIPS success, and even future existence, may depend on the reception given to the company's lastest product announcement; three families of Aptiv processor cores addressing the low, mid and high ends of the licensible processor core market. The three families are prefixed micro-, inter- and pro- respectively, with initials spelling out MIP and suggesting a Super family yet to come.


Related links and articles:

www.mips.com

News articles:

Handicapping the field of possible MIPS suitors

MIPS challenges ARM's Cortex with Aptiv launch

MIPS introduces Aptiv processor cores

ARM dominates 10 billion unit CPU core market




TAG:Broadcom MIPS processor IP license semiconductor

Toumaz buys radio chip firm for $50 million

Toumaz buys radio chip firm for $50 million

LONDON – Toumaz Ltd. (Abingdon, England) has agreed to buy fabless DAB radio chip firm Frontier Silicon (Holdings) Ltd. (London, England) for up to £32.3 million (about $50 million).

As a result Anthony Sethill, founder and former CEO of Frontier and now CEO of Toumaz, will get to resume leading the team of people he left at the end of 2011.

Toumaz, a developer of low-power wireless technology it applies to medical applications, said it intends to raise £29.25 million (about $46 million) before expenses to put towards the purchase of Frontier through a placing of 285.6 million shares.

Frontier, founded in 2001, is a supplier of chips for digital audio and audio subsystems. Frontier has around 130 staff, 70 percent engineers, with R&D centers in Cambridge, Ireland and Hong Kong.

Both companies are strongly linked to graphics processor IP licensor Imagination Technologies Group plc. Imagination has acted as a strategic partner and supporter of both Toumaz and Frontier and both companies supply chips to Imagination's Pure consumer electronics equipment subsidiary.

The deal has been constructed so that Toumaz will pay an initial £27.06 million (about $42.5 million) in cash with a deferred consideration up to £5.2 million (about $8.2 million), which will be paid, dependent on the performance of the enlarged company.

Toumaz emphasized that the deal is a good fit as Toumaz' medical aspirations fit with the consumer profile of Frontier. Frontier has in excess of £22 million ($34 million) in annual revenue and the acquisition would give Toumaz access to a customer list that includes Bang & Olufsen, Bose, JVC, Panasonic, Philips, Pure, LG, Roberts Radio and Sony.

"Bringing these two innovative UK technology companies will enable the enlarged Group to exploit the strengths and opportunities of both businesses. Our wireless solutions have huge potential and combined with the software systems, commercial expertise and tier one customer access of Frontier, will create a significant total solution provider for the wireless communications market," said Toumaz CEO Sethill, in a statement.


Related links and articles:

www.toumaz.com

www.frontier-silicon.com

News articles:

Imagination backs Toumaz wireless IC spinout

Frontier's Venice 7 modules take to the waves

Commentary: Digital radio needs makeover

TAG:Anthony Sethill Frontier Silicon Toumaz

Packaging takes front and center stage

Packaging takes front and center stage

Cadence has announced that it has bought Sigrity, a company that specialized in high-speed PCB design and packaging. This is significant to me in two ways. The first is that it is another event showing that the EDA market is heating up again. We have seen a few acquisitions and companies receiving funding recently, and this is a very good sign. The second is the growing importance of packaging and I am imagining that this will heat up with more 3D IC design, in that the package will take on a whole new meaning because what we used to think of being a PCB becomes part of the chip itself. I am sure much of this acquisition will just get integrated with the Cadence Orcad tool suite and will wither as a standalone tool set over time.

The acquisition of Sigrity was completed on July 2, 2012 at a purchase price of approximately $80 million. Primarily due to the impact of purchase accounting rules on deferred revenue and the transition to a ratable license model for Sigrity products, the transaction is expected to be slightly dilutive to fiscal 2012 earnings per share, and then slightly accretive for 2013. Cadence expects that the transition of Sigrity’s business to Cadence’s ratable business model, and the amortization of Sigrity’s deferred revenue will be substantially complete by the end of fiscal 2013. The transaction is not expected to impact Cadence’s previously disclosed profitability goals for fiscal 2013.

Brian Bailey – keeping you covered

---

If you found this article to be of interest, visit EDA Designline where you will find the latest and greatest design, technology, product, and news articles with regard to all aspects of Electronic Design Automation (EDA).

Also, you can obtain a highlights update delivered directly to your inbox by signing up for the EDA Designline weekly newsletter – just Click Here to request this newsletter using the Manage Newsletters tab (if you aren't already a member you'll be asked to register, but it's free and painless so don't let that stop you).
TAG:acquisition high speed board packaging

Toumaz buys radio chip firm for $50 million

Toumaz buys radio chip firm for $50 million

LONDON – Toumaz Ltd. (Abingdon, England) has agreed to buy fabless DAB radio chip firm Frontier Silicon (Holdings) Ltd. (London, England) for up to £32.3 million (about $50 million).

As a result Anthony Sethill, founder and former CEO of Frontier and now CEO of Toumaz, will get to resume leading the team of people he left at the end of 2011.

Toumaz, a developer of low-power wireless technology it applies to medical applications, said it intends to raise £29.25 million (about $46 million) before expenses to put towards the purchase of Frontier through a placing of 285.6 million shares.

Frontier, founded in 2001, is a supplier of chips for digital audio and audio subsystems. Frontier has around 130 staff, 70 percent engineers, with R&D centers in Cambridge, Ireland and Hong Kong.

Both companies are strongly linked to graphics processor IP licensor Imagination Technologies Group plc. Imagination has acted as a strategic partner and supporter of both Toumaz and Frontier and both companies supply chips to Imagination's Pure consumer electronics equipment subsidiary.

The deal has been constructed so that Toumaz will pay an initial £27.06 million (about $42.5 million) in cash with a deferred consideration up to £5.2 million (about $8.2 million), which will be paid, dependent on the performance of the enlarged company.

Toumaz emphasized that the deal is a good fit as Toumaz' medical aspirations fit with the consumer profile of Frontier. Frontier has in excess of £22 million ($34 million) in annual revenue and the acquisition would give Toumaz access to a customer list that includes Bang & Olufsen, Bose, JVC, Panasonic, Philips, Pure, LG, Roberts Radio and Sony.

"Bringing these two innovative UK technology companies will enable the enlarged Group to exploit the strengths and opportunities of both businesses. Our wireless solutions have huge potential and combined with the software systems, commercial expertise and tier one customer access of Frontier, will create a significant total solution provider for the wireless communications market," said Toumaz CEO Sethill, in a statement.


Related links and articles:

www.toumaz.com

www.frontier-silicon.com

News articles:

Imagination backs Toumaz wireless IC spinout

Frontier's Venice 7 modules take to the waves

Commentary: Digital radio needs makeover

TAG:Anthony Sethill Frontier Silicon Toumaz

Packaging takes front and center stage

Packaging takes front and center stage

Cadence has announced that it has bought Sigrity, a company that specialized in high-speed PCB design and packaging. This is significant to me in two ways. The first is that it is another event showing that the EDA market is heating up again. We have seen a few acquisitions and companies receiving funding recently, and this is a very good sign. The second is the growing importance of packaging and I am imagining that this will heat up with more 3D IC design, in that the package will take on a whole new meaning because what we used to think of being a PCB becomes part of the chip itself. I am sure much of this acquisition will just get integrated with the Cadence Orcad tool suite and will wither as a standalone tool set over time.

The acquisition of Sigrity was completed on July 2, 2012 at a purchase price of approximately $80 million. Primarily due to the impact of purchase accounting rules on deferred revenue and the transition to a ratable license model for Sigrity products, the transaction is expected to be slightly dilutive to fiscal 2012 earnings per share, and then slightly accretive for 2013. Cadence expects that the transition of Sigrity’s business to Cadence’s ratable business model, and the amortization of Sigrity’s deferred revenue will be substantially complete by the end of fiscal 2013. The transaction is not expected to impact Cadence’s previously disclosed profitability goals for fiscal 2013.

Brian Bailey – keeping you covered

---

If you found this article to be of interest, visit EDA Designline where you will find the latest and greatest design, technology, product, and news articles with regard to all aspects of Electronic Design Automation (EDA).

Also, you can obtain a highlights update delivered directly to your inbox by signing up for the EDA Designline weekly newsletter – just Click Here to request this newsletter using the Manage Newsletters tab (if you aren't already a member you'll be asked to register, but it's free and painless so don't let that stop you).
TAG:acquisition high speed board packaging

Analysts find May was weak month for chip market

Analysts find May was weak month for chip market

LONDON – The global market for chips was worth about $23 billion in May, according to Nomura Equity Research which has disclosed monthly by-sector statistics provided by the Semiconductor Industry Association.

The global chip revenue excluding memory in May was $18 billion down 2 percent compared with May 2011 and a reversal of fortune from April which had been up 3 percent year-on-year, Nomura said in a note to clients.

The decline was driven by a retreat in the analog and microprocessor chip markets, Nomura reported. The market for analog chips, at $3.2 billion in May, was down 10 percent year-on-year while microprocessor sales of $2.8 billion were down 9 percent year-on-year. This was not compensated for by other logic IC revenue of $6.3 billion in May, up 6 percent compared with May 2011.

Nomura also provided separate growth and decline figures for IC unit shipments and average selling prices (ASPs) for these major categories.

Total unit shipments for the overall chip market in May, excluding memory chips, declined 1 percent annually and the ASPs declined by 2 percent, Nomura said.

Analog units and ASPs were down 3 percent and down 7 percent, compared with May 2011, respectively. MPU units and ASPs were down 13 percent y/y and up 4 percent y/y.

Nomura noted that Intel and AMD no longer provide MPU statistics to the SIA via the World Semiconductor Trade Statistics (WSTS) organization. It is thought that WSTS will have tried to estimate the Intel and AMD positions.

Logic IC unit shipments in May were up 4 percent compared with May 2011 and ASPs for logic ICs were up 2 percent over May 2011.

The memory sector, valued at $5.0 billion in May, was down 6 percent on where it was in May 2011. Memory units were up 8 percent year-on-year while ASPs declined 13 percent.


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TAG:Nomura research market semiconductor Intel AMD analog microprocessor MPU

Analysts find May was weak month for chip market

Analysts find May was weak month for chip market

LONDON – The global market for chips was worth about $23 billion in May, according to Nomura Equity Research which has disclosed monthly by-sector statistics provided by the Semiconductor Industry Association.

The global chip revenue excluding memory in May was $18 billion down 2 percent compared with May 2011 and a reversal of fortune from April which had been up 3 percent year-on-year, Nomura said in a note to clients.

The decline was driven by a retreat in the analog and microprocessor chip markets, Nomura reported. The market for analog chips, at $3.2 billion in May, was down 10 percent year-on-year while microprocessor sales of $2.8 billion were down 9 percent year-on-year. This was not compensated for by other logic IC revenue of $6.3 billion in May, up 6 percent compared with May 2011.

Nomura also provided separate growth and decline figures for IC unit shipments and average selling prices (ASPs) for these major categories.

Total unit shipments for the overall chip market in May, excluding memory chips, declined 1 percent annually and the ASPs declined by 2 percent, Nomura said.

Analog units and ASPs were down 3 percent and down 7 percent, compared with May 2011, respectively. MPU units and ASPs were down 13 percent y/y and up 4 percent y/y.

Nomura noted that Intel and AMD no longer provide MPU statistics to the SIA via the World Semiconductor Trade Statistics (WSTS) organization. It is thought that WSTS will have tried to estimate the Intel and AMD positions.

Logic IC unit shipments in May were up 4 percent compared with May 2011 and ASPs for logic ICs were up 2 percent over May 2011.

The memory sector, valued at $5.0 billion in May, was down 6 percent on where it was in May 2011. Memory units were up 8 percent year-on-year while ASPs declined 13 percent.


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TAG:Nomura research market semiconductor Intel AMD analog microprocessor MPU

Cadence pays $80 million to buy signal integrity firm

Cadence pays $80 million to buy signal integrity firm

LONDON – EDA software vendor Cadence Design Systems Inc. (San Jose, Calif.) has announced it has paid approximately $80 million to acquire Sigrity Inc. (Campbell, Calif.), a supplier of signal, power and thermal integrity analysis software and IC package design tools. The acquisition was completed on July 2.

Cadence said it will offer Sigrity technologies immediately as add-on options to its Allegro and Orcad PCB and IC packaging tools. Cadence said it will support Sigrity technologies where they has been incorporated into third-parties' design software.

The combination of Cadence and Sigrity tools would enable system and semiconductor companies to deliver high-performance devices employing gigabit interface protocols such as DDR and PCI Express, Cadence said.

"Cadence and Sigrity have worked together for years to enable design and analysis of the industry's most advanced PCBs, system-in-packages, and SoCs," said Jiayuan Fang, president of Sigrity, in a statement issued by Cadence.

Sigrity began operations in 1997 with an award from the National Science Foundation to help it develop a hybrid electromagnetic field solver for multi-layer electronic packages and boards. The company now has more than 100 employees with greater than 60 percent engineers working in R&D.


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Cadence pays $80 million to buy signal integrity firm

Cadence pays $80 million to buy signal integrity firm

LONDON – EDA software vendor Cadence Design Systems Inc. (San Jose, Calif.) has announced it has paid approximately $80 million to acquire Sigrity Inc. (Campbell, Calif.), a supplier of signal, power and thermal integrity analysis software and IC package design tools. The acquisition was completed on July 2.

Cadence said it will offer Sigrity technologies immediately as add-on options to its Allegro and Orcad PCB and IC packaging tools. Cadence said it will support Sigrity technologies where they has been incorporated into third-parties' design software.

The combination of Cadence and Sigrity tools would enable system and semiconductor companies to deliver high-performance devices employing gigabit interface protocols such as DDR and PCI Express, Cadence said.

"Cadence and Sigrity have worked together for years to enable design and analysis of the industry's most advanced PCBs, system-in-packages, and SoCs," said Jiayuan Fang, president of Sigrity, in a statement issued by Cadence.

Sigrity began operations in 1997 with an award from the National Science Foundation to help it develop a hybrid electromagnetic field solver for multi-layer electronic packages and boards. The company now has more than 100 employees with greater than 60 percent engineers working in R&D.


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Cadence tips faster Spice coming soon

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Sigrity accelerates high-speed serial link design

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沪珠宝业首开融资担保

沪珠宝业首开融资担保

　　本报讯 (记者陈惟 通讯员缪立义)上海珠宝行业首获融资性担保机构经营许可。由民营翡翠大王张铁军投资95%的上海泰运融资担保公司，日前开始向上海及全国各地的中小企业、小微企业以及个人投资者提供快捷便利的金融服务。

　　“这比用房产或证券抵押快得多。”两位小老板用家里收藏的和田玉作为反担保标的物，成功从银行贷款500万元流动资金。同时，工商银行、招商银行、农业银行、中国银行、民生银行、建设银行、广发银行、大连银行等八家银行与上海泰运融资担保公司签订了融资贷款担保协议

TAG:沪珠宝业首开融资担保

Analyst lowers chip market forecast for 2012

Analyst lowers chip market forecast for 2012

LONDON – Actual global chip sales for May 2012 are likely to be reported at about 3 percent lower than the same month in 2011, according to Bruce Diesen, an analyst at Carnegie Group (Oslo, Norway).

The analyst has also revised down to flat his estimate for how the global chip market will perform in 2012 compared with 2011, falling in line with forecasts from the Semiconductor Industry Association and World Semiconductor Trade Statistics organization. Diesen said he expects semiconductor sales to be unchanged this year and rise 7 percent in 2013 whereas previously he had forecast semiconductor sales in 2012 would show a 2 percent increase in dollars compared with 2011.

Diesen's estimate for May would be a return to a year-on-year decline after April 2012 actual global sales at $23.85 billion were 1.1 percent ahead actual global sales in April 2011.

Diesen predicted that the three-month average chip sales in May will be reported at $24.2 billion, slightly up on an equivalent figure in April of $24.1 billion.

"Handset chips probably were one area that weakened in May after a strong April," Diesen said.


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TAG:Bruce Diesen Carnegie semiconductor forecast

Analyst lowers chip market forecast for 2012

Analyst lowers chip market forecast for 2012

LONDON – Actual global chip sales for May 2012 are likely to be reported at about 3 percent lower than the same month in 2011, according to Bruce Diesen, an analyst at Carnegie Group (Oslo, Norway).

The analyst has also revised down to flat his estimate for how the global chip market will perform in 2012 compared with 2011, falling in line with forecasts from the Semiconductor Industry Association and World Semiconductor Trade Statistics organization. Diesen said he expects semiconductor sales to be unchanged this year and rise 7 percent in 2013 whereas previously he had forecast semiconductor sales in 2012 would show a 2 percent increase in dollars compared with 2011.

Diesen's estimate for May would be a return to a year-on-year decline after April 2012 actual global sales at $23.85 billion were 1.1 percent ahead actual global sales in April 2011.

Diesen predicted that the three-month average chip sales in May will be reported at $24.2 billion, slightly up on an equivalent figure in April of $24.1 billion.

"Handset chips probably were one area that weakened in May after a strong April," Diesen said.


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TAG:Bruce Diesen Carnegie semiconductor forecast

Terahertz emitter harnesses 45-nm CMOS

Terahertz emitter harnesses 45-nm CMOS

DALLAS -- Millimeter wavelength alternatives to traditional X-rays are already using terahertz-range frequencies to safely scan passengers, luggage and cargo at airports, albeit using bulky discrete devices. Silicon-based terahertz range emitters and detectors could downsize millimeter wave devices for a wide variety of applications beyond airport security, including safer medical imaging along with industrial and environmental applications aimed at detecting hazardous substances.

Earlier this year, Semiconductor Research Corp. (SRC, Research Triangle, N.C.) sponsored research demonstrating a CMOS detector operating in the terahertz range</A>. Now, Texas Instrument's has demonstrated a companion terahertz-range emitter created in cooperation with the SRC-sponsored Texas Analog Center of Excellence at the University of Texas at Dallas. TI's terahertz-range emitter uses a phase-locked loop (PLL) to stabilize its frequency, a necessity for making millimeter wavelength systems in CMOS commercially feasible.

"This is the highest frequency ever demonstrated for a phase-locked loop," claimed Brian Ginsburg, a design engineer at TI's Kilby Labs. "Stabilizing these ultra-high frequencies is [the] key to the future commercial success of millimeter wavelength CMOS applications [and] PLLs are fundamental to all high-performance electronics."

TI’s demonstration used an on-chip antenna that emits 390-GHz frequencies, but the researchers believe that improvements will enable the CMOS emitter to reach 600 GHz or higher using TI's 45-nm process technology.

"The [Federal Communications Commission] defines the terahertz range to be from 300 GHz to 3 THz," said Eunyoung Seok, a design engineer at TI's Kilby Labs. "For the future, we want to use TI's 45-nanometer process to cover more of this wider frequency range, as well as to increase our output power."

The current demonstration chip operates at 390 GHz using a multiplying PLL architecture with two frequency dividers in the feedback loop. The power emanating from the on-chip antenna was 2.2 microWatts.

In some applications, the ultra-high-frequency output from the on-chip antenna can be propagated and reflected by lenses and other optical components since the terahertz-range wavelengths are between the far infrared and microwave frequencies used for communications.





The world's first phase-locked loop for a CMOS terahertz emitter harnesses 45-nm process with on-chip antenna.
SOURCE: TI

TAG:Terahertz Millimeter Wavelength X Ray Texas Instruments TI EETimes NextGenLog Electronics

Terahertz emitter harnesses 45-nm CMOS

Terahertz emitter harnesses 45-nm CMOS

DALLAS -- Millimeter wavelength alternatives to traditional X-rays are already using terahertz-range frequencies to safely scan passengers, luggage and cargo at airports, albeit using bulky discrete devices. Silicon-based terahertz range emitters and detectors could downsize millimeter wave devices for a wide variety of applications beyond airport security, including safer medical imaging along with industrial and environmental applications aimed at detecting hazardous substances.

Earlier this year, Semiconductor Research Corp. (SRC, Research Triangle, N.C.) sponsored research demonstrating a CMOS detector operating in the terahertz range</A>. Now, Texas Instrument's has demonstrated a companion terahertz-range emitter created in cooperation with the SRC-sponsored Texas Analog Center of Excellence at the University of Texas at Dallas. TI's terahertz-range emitter uses a phase-locked loop (PLL) to stabilize its frequency, a necessity for making millimeter wavelength systems in CMOS commercially feasible.

"This is the highest frequency ever demonstrated for a phase-locked loop," claimed Brian Ginsburg, a design engineer at TI's Kilby Labs. "Stabilizing these ultra-high frequencies is [the] key to the future commercial success of millimeter wavelength CMOS applications [and] PLLs are fundamental to all high-performance electronics."

TI’s demonstration used an on-chip antenna that emits 390-GHz frequencies, but the researchers believe that improvements will enable the CMOS emitter to reach 600 GHz or higher using TI's 45-nm process technology.

"The [Federal Communications Commission] defines the terahertz range to be from 300 GHz to 3 THz," said Eunyoung Seok, a design engineer at TI's Kilby Labs. "For the future, we want to use TI's 45-nanometer process to cover more of this wider frequency range, as well as to increase our output power."

The current demonstration chip operates at 390 GHz using a multiplying PLL architecture with two frequency dividers in the feedback loop. The power emanating from the on-chip antenna was 2.2 microWatts.

In some applications, the ultra-high-frequency output from the on-chip antenna can be propagated and reflected by lenses and other optical components since the terahertz-range wavelengths are between the far infrared and microwave frequencies used for communications.





The world's first phase-locked loop for a CMOS terahertz emitter harnesses 45-nm process with on-chip antenna.
SOURCE: TI

TAG:Terahertz Millimeter Wavelength X Ray Texas Instruments TI EETimes NextGenLog Electronics

Researchers try vacuum transistors at low voltage

Researchers try vacuum transistors at low voltage

LONDON – Researchers at the University of Pittsburgh have come up with a device structure that allows a switch back to vacuum, in contrast to the solid-state, as the medium for electron transport in transistors.

The team is proposing a MOS vertical structure with a triple layer of metal/silicon dioxide/silicon exposed on the side by a deep trench. The metal and silicon layers form the anode and cathode of the device, separated by the insulating silicon dioxide, and the electron transport occurs in the vertical direction through the vacuum.

The work is discussed in a research paper entitled Metal-oxide-semiconductor field effect transistor with a vacuum channel, published in Nature Nanotechnology July 1.

The work represents a return to the roots of electronics. The solid-state transistor was invented in 1947 as a replacement for the bulky, unreliable vacuum tube. Vacuum tube style electronics in miniature made using solid-state semiconductor manufacturing techniques have been tried before, but the concept has struggled to overcome requirements for high voltage and issue of compatibility with the incumbent solid-state CMOS technology.

A team under Hong Koo Kim, principal investigator on the project and a Professor in the University of Pittsburgh's Swanson School of Engineering, has redesigned the structure of the vacuum electronic device. With the assistance of PhD candidate Siwapon Srisonphan and postdoctoral fellow Yun Suk Jung Kim and his team discovered that electrons trapped inside a semiconductor at the interface with an oxide or metal layer can be easily extracted out into the air. The electrons at the material interface form a sheet of charges, a two-dimensional electron gas and Kim found that the Coulombic repulsion of the electrons for each other enables the easy emission of electrons out of the silicon.

This allows the creation of a low-voltage device in which the electrons travel ballistically in air in a nanometer-scale channel without any collisions or scattering.

The channel length is of the order of 20-nm and the team measured a transconductance of 20-nS per micron and an on/off ratio of 500 and turn-on gate voltage of 0.5-V under ambient conditions, according to the paper's abstract.

"The emission of this electron system into vacuum channels could enable a new class of low-power, high-speed transistors, and it's also compatible with current silicon electronics, complementing those electronics by adding new functions that are faster and more energy efficient due to the low voltage," said Professor Kim, in a statement.


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TAG:University of Pittsburgh vacuum transistor research silicon low volatge FIB semiconductor

Researchers try vacuum transistors at low voltage

Researchers try vacuum transistors at low voltage

LONDON – Researchers at the University of Pittsburgh have come up with a device structure that allows a switch back to vacuum, in contrast to the solid-state, as the medium for electron transport in transistors.

The team is proposing a MOS vertical structure with a triple layer of metal/silicon dioxide/silicon exposed on the side by a deep trench. The metal and silicon layers form the anode and cathode of the device, separated by the insulating silicon dioxide, and the electron transport occurs in the vertical direction through the vacuum.

The work is discussed in a research paper entitled Metal-oxide-semiconductor field effect transistor with a vacuum channel, published in Nature Nanotechnology July 1.

The work represents a return to the roots of electronics. The solid-state transistor was invented in 1947 as a replacement for the bulky, unreliable vacuum tube. Vacuum tube style electronics in miniature made using solid-state semiconductor manufacturing techniques have been tried before, but the concept has struggled to overcome requirements for high voltage and issue of compatibility with the incumbent solid-state CMOS technology.

A team under Hong Koo Kim, principal investigator on the project and a Professor in the University of Pittsburgh's Swanson School of Engineering, has redesigned the structure of the vacuum electronic device. With the assistance of PhD candidate Siwapon Srisonphan and postdoctoral fellow Yun Suk Jung Kim and his team discovered that electrons trapped inside a semiconductor at the interface with an oxide or metal layer can be easily extracted out into the air. The electrons at the material interface form a sheet of charges, a two-dimensional electron gas and Kim found that the Coulombic repulsion of the electrons for each other enables the easy emission of electrons out of the silicon.

This allows the creation of a low-voltage device in which the electrons travel ballistically in air in a nanometer-scale channel without any collisions or scattering.

The channel length is of the order of 20-nm and the team measured a transconductance of 20-nS per micron and an on/off ratio of 500 and turn-on gate voltage of 0.5-V under ambient conditions, according to the paper's abstract.

"The emission of this electron system into vacuum channels could enable a new class of low-power, high-speed transistors, and it's also compatible with current silicon electronics, complementing those electronics by adding new functions that are faster and more energy efficient due to the low voltage," said Professor Kim, in a statement.


Related links and articles:

Nature Nanotechnology article

News articles:

Research finds semiconductor derivative of graphene

Researchers find bilayer graphene acts as insulator

EE Times' 20 hot technologies for 2012

TAG:University of Pittsburgh vacuum transistor research silicon low volatge FIB semiconductor

China, U.S. lead innovation, Europe nowhere, says survey

China, U.S. lead innovation, Europe nowhere, says survey

LONDON – China and the United States are the two countries most likely to come up with "disruptive technology breakthroughs" with a global impact in the next two to four years, according to a survey conducted by auditor and consultancy KPMG (Amstelveen, The Netherland).

Nearly one third of respondents (30 percent) said China will be the future "global hotspot for innovation," followed by the United States with 29 percent, India (13 percent), Japan (8 percent) and Korea (5 percent). The United Kingdom ranks 11th and was named by just 1 percent of respondents.

"More and more technology executives believe that when it comes to tech innovation the center of gravity is moving east. Until now China has been better known for its disruptive cost model rather than its disruptive technologies but things are beginning to change," said Tudor Aw, technology sector head for KPMG Europe LLP, in a statement.

The survey also showed that 43 percent of respondents said it is likely that the technology innovation center of the world will move from Silicon Valley to another country in the next four years. China was named as the country most likely to be the next innovation centre (45 percent), followed by India (21 percent) and Japan tied with Korea on 9 percent each.

The survey was conducted with 668 technology business executives between March 2012 and May 2012 with 34 percent of the respondents based in the Americas, 42 percent in Asia Pacific, and 23 percent in Europe, Middle East and Africa.

The survey revealed that the technology sector set to have the biggest business impact in four year's time is likely to be mobile devices named by 28 percent of respondents. Some 17 percent referenced cloud computing and storage and 13 percent advanced IT and 3-D technology.

The barriers to commercializing these technologies are thought to be security and privacy governance (30 percent), followed by funding and access to capital (24 percent) and technology complexity (24 percent).

Another snippet from the survey was that the respondents considered the top approach to motivating innovation amongst employees was to provide financial incentives (39 percent).


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www.kpmg.com

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TAG:United States United Kingdom survey KPMG technology innovation

China, U.S. lead innovation, Europe nowhere, says survey

China, U.S. lead innovation, Europe nowhere, says survey

LONDON – China and the United States are the two countries most likely to come up with "disruptive technology breakthroughs" with a global impact in the next two to four years, according to a survey conducted by auditor and consultancy KPMG (Amstelveen, The Netherland).

Nearly one third of respondents (30 percent) said China will be the future "global hotspot for innovation," followed by the United States with 29 percent, India (13 percent), Japan (8 percent) and Korea (5 percent). The United Kingdom ranks 11th and was named by just 1 percent of respondents.

"More and more technology executives believe that when it comes to tech innovation the center of gravity is moving east. Until now China has been better known for its disruptive cost model rather than its disruptive technologies but things are beginning to change," said Tudor Aw, technology sector head for KPMG Europe LLP, in a statement.

The survey also showed that 43 percent of respondents said it is likely that the technology innovation center of the world will move from Silicon Valley to another country in the next four years. China was named as the country most likely to be the next innovation centre (45 percent), followed by India (21 percent) and Japan tied with Korea on 9 percent each.

The survey was conducted with 668 technology business executives between March 2012 and May 2012 with 34 percent of the respondents based in the Americas, 42 percent in Asia Pacific, and 23 percent in Europe, Middle East and Africa.

The survey revealed that the technology sector set to have the biggest business impact in four year's time is likely to be mobile devices named by 28 percent of respondents. Some 17 percent referenced cloud computing and storage and 13 percent advanced IT and 3-D technology.

The barriers to commercializing these technologies are thought to be security and privacy governance (30 percent), followed by funding and access to capital (24 percent) and technology complexity (24 percent).

Another snippet from the survey was that the respondents considered the top approach to motivating innovation amongst employees was to provide financial incentives (39 percent).


Related links and articles:

www.kpmg.com

News articles:

Marvell aims to be China chip leader

Report: Qualcomm wafer fab not ruled out

Rebuilding America: Silicon Valley is back

Join the Conversation: Is Silicon Valley losing its mojo?

TAG:United States United Kingdom survey KPMG technology innovation

指尖上的“动物园”珠宝大赏

指尖上的“动物园”珠宝大赏

Boucheron（宝诗龙）自70年代陆续推出动物珠宝，至2005年正式推出以动物为主的BESTIAIRE彩色动物园系列，栩栩如生的造型加上天马行空的创意，孕育而出品牌的灵魂代表，不论是色彩斑斓的变色龙、蜗牛，或是小巧可爱的青蛙及刺猬，每一款动物珠宝皆充满个性，每一颗宝石皆蕴藏一段故事。精致小巧的动物更是考验工匠的功力，张扬的羽翼、微勾的尾巴或是含情的神态，皆在纤细指间尽现细节，鲜明的彩宝配色更是赋予动物系列丰富神采，展现超越想像的力量！

2012年，延续BESTIAIRE彩色动物园系列和去年的Cabinet of Curiosities奇幻百宝箱系列，BOUCHERON再添数名生力军，包括全新创作的BAGHA老虎系列，为威风凛凛的百兽之王增添可爱气息；另外两款为换上新衣PEGASE宝马戒指新款镶嵌全白鑚，灿烂羽翼挥洒来自希腊神话的浪漫；TORTUE乌龟戒指，则是以虎眼石取代原来的粉水晶，俏皮之中展现别有风味的洗练。

BAGHA老虎系列 华丽的百兽之王

来自丛林的百兽之王，顶着一身斑斓的条纹皮毛，壮硕的身躯踏着稳健的步伐，看似慵懒却又蓄势待发，BOUCHERON将老虎的王者风范融入设计，唯妙唯肖刻画BAGHA老虎系列，BOUCHERON在老虎威风的外型中，加入些许BOUCHERON特有的俏皮巧思，精雕细琢的面部闪烁著聪慧的祖母绿双眼，攀附于指尖的双爪和微微勾起的虎尾更是让人爱不释手，为凶猛的老虎增添一丝可爱气息。BAGHA老虎系列共有18K玫瑰金及白K金两款，BAGHA玫瑰金老虎戒指，在玫瑰金身躯上镶嵌白鑚及黑色刚玉虎纹，白鑚的闪烁和黑色刚玉的浓厚映衬著玫瑰金色泽，渲染出老虎华丽的皮毛，而BAGHA白K金老虎戒指则以白K金塑型，镶嵌黑色刚玉作为虎纹，单纯的色泽勾勒雪地老虎的灵气，两款风格迥然不同。

PEGASE宝马戒指，334 颗钻石共2,73克拉， 2 颗蓝宝石共0,03克拉

PEGASE宝马系列的灵感源自希腊神话，传说中PEGASE是一匹拥有洁白羽翼的天马，从海中而生却能遨游于天际，每当牠在地面落足，将为大地带来鲜美涌泉，同时牠也象征文学的灵感。BOUCHEORN将希腊神话的浪漫化为真实，精心打造PEGASE宝马戒指，塑造出宝马俊逸的头部俯首于流线感十足的翅膀。2012全新PEGASE宝马戒指，18K白K金镶嵌全白钻，流畅勾勒飘逸的鬃毛和翅膀，钻石的闪烁光芒诠释宝马耀眼夺目的洁白身躯，衬托出蓝宝石双眼的温柔神情。同系列包括镶嵌蓝紫色刚玉的PEGASE宝马戒指，色调犹如染上来自天空和海洋的澄净色彩；而高级订制版本则包括于翅膀中央镶嵌主石的戒指，和一只镶满钻石的PEGASE宝马手镯，更加细腻繁复的羽翼和鬃毛，呈现出不同凡响的灵气与磅礡气势。

TORTUE 乌龟系列 天真烂漫的智者

TORTUE 乌龟系列以18K玫瑰金生动地塑造出乌龟流畅的身躯和微微昂首的姿态，头部仿佛微笑般上扬的嘴角线条，搭配祖母绿镶嵌双眼，自然活泼的神情格外讨人喜爱。BOUCHERON自2006年推出TORTUE粉水晶乌龟戒，精选粉红水晶主石，细腻流畅的雕凿出外壳圆润的弧度和放射状纹路，粉嫩的色调为动物系列添一份俏皮的春意！时隔六年，2012年BOUCHERON重新诠释品牌经典TOUTUE乌龟系列，精巧工艺雕凿虎眼石作为乌龟外壳，虎眼石沉稳神秘的色调有别于粉水晶的春意盎然，展现TORTUE乌龟系列充满成熟智慧的气质，搭配玫瑰金打造的小巧尾巴与镶满钻石的四肢，精致外型为TORTUE虎眼石乌龟戒指增添一抹柔和，将BOUCHERON工匠的巧思发挥得淋漓尽致。

TAG:宝诗龙 动物珠宝 乌龟戒指

当代艺术品市场和收藏市场快讯

当代艺术品市场和收藏市场快讯

　　世界当代艺术品市场前五月涨3.6%

　　■收藏快讯

　　根据梅摩艺术品指数研究中心最新发布的报告，梅摩世界当代艺术品指数在2012年前5个月上涨了3.6%。众所周知，世界当代艺术是艺术品市场中波动最剧烈的板块。受到世界经济下滑的影响，当代艺术在今年第一季度有所走低。虽然世界当代经济最近的回升速度较为缓慢，但对于低迷的欧洲市场而言，这无疑是一个振奋人心的消息。

　　鸡血石跌幅超30%

　　今年以来，艺术品市场整体不景气，除了个别精品之外，大部分鸡血石的价格都有所下跌，对比去年底到今年初期的高价，鸡血石的跌幅已经超过了30%，且交易量也有所下滑。

　　“红色足迹”特种邮票首发

　　近日，“红色足迹”特种邮票首发式暨集邮展览活动在井冈山风景区举行。本次由中国邮政集团公司发行的“红色足迹”特种邮票一套6枚，分别选取井冈山、瑞金、遵义、会宁、延安和西柏坡等6处对中国革命具有重要意义的纪念地为内容，面值1.20元，其中第一枚为井冈山。邮票采用钢笔淡彩的表现手法，展示了红色革命根据地的旧貌新颜，画面横向铺陈，并以飘扬的红旗装饰。邮票采用胶雕套印工艺，规格为50×30毫米，设计者为阎炳武、史渊。

　　南方日报(微博)记者 谢梦

TAG:当代艺术品市场和收藏市场快讯

5000年前苏北人是玉器控奢华控

5000年前苏北人是玉器控奢华控

　　5200多年前,环太湖流域诞生了非常强大的文明——良渚文化.传说蚩尤就是良渚人.然而这个强大的文明,在4000多年前突然消失了.

　　什么原因导致了良渚文明的消失？从去年8月开始,南京博物院考古研究所配合泰东河水利工程建设,对兴化张郭镇蒋庄遗址进行了考古发掘,有望解开这一谜团.

　　□现代快报(微博)记者 胡玉梅

　　意义非凡

　　良渚文化遗址跨江到苏北

　　在这里,考古专家们发现了面积达2万平方米的良渚遗址,目前挖掘了其中的3000平方米左右,发现了两百多座古墓葬,联排房址、大量陶器、石器,以及玉琮、玉璧、炭化种子……

　　南京博物院考古研究所所长林留根介绍,良渚文化是新石器时期高度发达的文明类型,距今5300年至4000年,核心在环太湖地区,过去认为良渚文化遗址不会越过长江.而这次恰恰在长江以北200多公里发现了良渚中晚期遗址,让良渚文化遗址扩展到了苏北,让考古界非常惊喜.

　　衰亡原因

　　可能是太奢华

　　林留根说,良渚文化在4000多年前就神秘消失了.是什么原因导致的？有一说是洪水泛滥导致的,蒋庄遗址的确发现了洪水淤积层；还有一种说法是内忧外患,导致了良渚文化风流云散,向南跑到了浙江南部,向北到新沂乃至延安一带,向西到四川的金沙,而蒋庄遗址在泰东河边,恰恰可以证明一条曾经向北迁徙的路线.

　　“蒋庄遗址在良渚文化的边缘,这里出土的玉璧、玉琮比核心区少多了,这也说明,这个部落是为核心区提供财富和开拓疆土的.”林留根说,这也从另一方面说明,良渚文化消失原因之一是太奢华,全都造玉器去了.

　　据了解,有关部门拟将申请蒋庄遗址列为“国家文物控保单位”和“2012年度全国十大考古重大发现”.

　　惊喜连连

　　1 墓中遗骨相对完好,良渚人相貌将复原

　　考古工地紧紧挨着泰东河,泥土泛着黑色.为方便看土层,3000平方米的考古现场被切割成东西两块.这里一共发现了两百多座良渚中晚期古墓葬(距今5000年~4600年),这些古墓葬南北分布,有等级、尊卑之分.从考古发掘来看,北片应该是平民的埋葬区,而南片则是“高富帅”埋葬区.

　　专家说,根据牙齿、遗骨等可以判断出古墓中墓主们当时的死亡年龄,他们寿命普遍不长,能活到五六十岁已经很长寿了,三四十岁就死亡的大有人在,还有的是中途夭折的孩子.从身高来看,良渚人个头都不矮,男性已经有1.7米左右了.

　　林留根说,在已发现的良渚文化遗址中,墓葬数目最多的是230座,而蒋庄遗址目前已经发现了222座左右.

　　“浙江余杭一带,良渚文化核心区遗址泥土呈酸性,尽管古墓多,但几乎没有人骨保存下来.蒋庄遗址却很幸运,他们死后依水而眠,地下水充足,加上泥土相对偏碱性,这种恒温恒湿的环境让近5000年的遗骨很好地保留至今.”

　　未来,专家将为这些遗骨做碳14测定,可以知道他们更为确切的生活年代；同时,还要对他们做DNA鉴定,可以知道这些墓主之间的关系是什么样的,他们是因为什么死亡的,常见病痛是什么.

　　林留根还透露,目前考古队已经取走了保存完好的头骨,以期利用电脑复原良渚人的相貌.“传说中良渚人铜头铁额、三头六臂、刀枪不入……甚至有传说认为,蚩尤是良渚人.”通过科技手段复原,我们就可以知道良渚人到底长什么样了.

　　2 陶罐上狩猎野猪图,最早图像文字之一

　　考古现场出土的文物以陶器居多,尽管是5000年前造的,但器型精美.陶器中既有实用物品,也有专门用来陪葬的,鼎、双鼻壶、大罐、刻纹陶罐,器型规整漂亮,显示出高超的工艺水准和审美水平,有些鼎和罐上还有火烧过后的黑色烟灰,留下了人间烟火的痕迹.

　　让考古人员惊喜的是一个黑陶罐上的图案.图案上画着,一支箭状物下,吊着一头被绑的野猪……“这是最早的图像文字,内容是狩猎归来.”林留根说.

　　3 除了精美玉器,还有神秘“天下第一尊”

　　随葬品最多的是140号墓穴,墓主是位男性,尸骨完整.墓主左手和脚下有4个石钺,右手边摆的是石锛,左下巴处还有一只玉挂件.玉挂件5厘米长,筷子粗细.考古队员甘恢元说,石钺是部族军队首领所使用的一种兵器,墓主生前可能拥有军权.

　　现场还出土了玉璧、玉琮、玉镯、玉珠等,大的玉璧一共有六七块,直径都有26厘米左右,墨绿色泛着莹光；玉琮微黄,有一高一矮两件,而玉镯子看上去很通透……林留根说,良渚文化是一个非常奢侈的文化,当时的人们把大量的财富都用来造玉璧、玉琮.现在中国人对玉情有独钟,正是对5000多年前文化因子的传承.

　　让林留根感到疑惑的是,考古现场出土了一个口径80厘米左右的尊,被称作“天下第一尊”.尊的胎很厚,上面布满了一圈圈的花纹.“尊被打碎了几百块,是一点点拼接修复出来的.它也是墓主尊贵身份的象征.但是干什么用的,却没办法解释.”

　　神秘船棺

　　船棺内有人殉葬却没玉器 墓主可能是降将

　　偌大的墓葬区,有一口古棺看上去就像一艘木船,木船内躺着一男一女两人,船头放了两颗人头,船尾放着四颗人头.细细看去,这个船棺是用一棵非常巨大的整木掏挖而成,船棺长度超过2.5米,宽度超过1米,其他古墓和它相比,显得颇为寒碜.船棺的墓主是一位男性,上门牙中的侧门齿被连根拔除；他旁边躺着的女性连头也没有……两具遗骨摆放凌乱.

　　林留根说,这位船棺墓主能独享一个船棺,而且有六颗首级殉葬,可见他地位非凡、是个狠角色.

　　但是让林留根疑惑的是,这么一位身份显赫的大人物,居然没有玉璧、玉琮等贵重物品陪葬,这又如何解释？

　　“从殉葬的头骨来看,其中一个还是被砍下了天灵盖,手段极其残忍.”林留根说,这位狠角色有拔齿习俗,说明他很可能是从北方来的降将.这位外来的“将军”骁勇善战,心狠手辣,为良渚的这个部落立下了赫赫战功,不幸的是,他本人也战死在沙场.蒋庄遗址部落的人们为了感谢这位大人物,把他的遗骨捡回来,埋葬在这里.“身边的女人很有可能是他生前喜欢的战俘,殉葬的六颗首级,也有可能是他战场上杀掉的战俘.”

　　考古队员甘恢元说,之所以没有陪葬玉琮、玉璧等贵重物品,可能是考虑到他毕竟不是良渚本土的大将军,因此墓葬规格被降低了.

　　艰辛的田园生活

　　吃稻米瓜果圈养猪狗羊

　　5000多年前的良渚人吃什么、用什么,他们怎么过日子？考古现场出土了很多非常有趣的文物,这些文物把我们仿佛又带到了5000多年前.

　　考古现场,工人们把泥土一点点刷起盛放在贝壳上,再细小的文物也逃不过他们的眼睛.“我们在好几麻袋的泥土中,用放大镜一点点寻找,找到了炭化的稻米、菱角、桃核、葫芦籽、甜瓜籽和芡实等.”甘恢元说,当时,水稻应该已经大量种植,5000多年前的人们已过上了田园式的生活.

　　当时的人们已经开始养猪、狗和羊.考古现场就发现了猪、狗等动物的骨头.而当时周边生活的麋鹿,则是他们的美食.考古人员甚至发现了用麋鹿角制作的锄头.

　　现场考古人员还发现了垂钓用的钩子,还有吃剩的昂刺鱼骨头.“他们依水而居,如果要出门,就乘船从泰东河出发,可以北上一直到新沂.如果累了,可以钓钓鱼,还是挺休闲的.”

　　泥巴和草搭成的

　　三居室不到30m2

　　良渚人住的房子什么样？现场,考古人员在地上用白粉笔勾画出或方或圆的房址,面积都不大.甘恢元说,当时人住的房子是方形或圆形的,先在地上挖好坑,插进一根根木头,再用草和树枝等拌泥糊成木骨泥墙,再用火烤干,用树枝和茅草苫顶,一个房子就盖好了.当时的房子面积不大,一套三居室一字排开也达不到30平方米,门的宽度仅容一人通过,冬天一家人晚上就睡在炉灶边取暖.

　　生活艰辛

　　1/5的人未成年就夭亡

　　看似非常浪漫而田园的生活,其实充满艰辛.考古队员朱晓汀说,由于食物粗糙,良渚人的牙齿磨损得要比现在人严重10年上下.而且,当时未满18周岁就死亡的人数比较大,通过对古墓人骨的研究,发现未满18岁就夭折的占部落人数的20%,每5个死者中就有一个是未成年人,这在今天是不可想像的.

来源:新浪收藏
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TAG:5000年前苏北人是玉器控奢华控 翡翠 翡翠手镯 feicui 翡翠观音 jade 七彩云南 云南翡翠 缅甸翡翠 瑞丽翡翠

中国奇石节7月10日在泸州举行

中国奇石节7月10日在泸州举行

　　泸州新闻网·泸州全搜索7月2日报道(记者 段婉露)泸州新闻网记者从有关方面获悉，第三届“中国奇石节”将于7月10日在中国酒城泸州举行。

　　“7·10”，谐音“奇石”。泸州奇石文化源远流长，泸州奇石爱好者众多，在泸州和全国众多奇石爱好者的倡导下，从2010年7月10日开始，将每年的7月10日作为奇石爱好者的节日。

　　泸州是长江上游的第二个城市，是长江奇石的发源地。120公里的泸州长江河段，是长江奇石形成条件最好，发育最成熟的河段。得天独厚的地质、地理、水文、人文条件，使泸州成为长江奇石最大的产区。泸州长江奇石不仅藏量大，产量高，而且种类多，品质好，是长江奇石中具有典型代表性的奇石，同时也是中国和世界江河卵石类奇石的代表性奇石。

　　据了解，泸州奇石多次在全国及国际石展上荣获金奖。逾万枚泸州奇石在国内上百种报纸、杂志、图书和几乎所有全国性奇石画册上登载。数百枚泸州奇石10多次在中央、省、市电视合及欧洲电视合播出。据不完全统计，泸州拥有上万名奇石爱好者，形成一个集数百家经营性石馆、家庭石馆、石农、石贩和地摊市场于一体的多层次多样化综合性奇石市场，吸引着全国各地及韩国、日本、美国等外国石友、石商、藏石家和奇石爱好者纷纷到泸州赏石、采石、购石。泸州奇石分布最广、产量最大、品质最好、最具代表性，已经成为国内外藏石家竞相收藏的珍品。奇石已成为泸州一张亮丽的城市名片。

　　据中国观赏石协会会员白成军介绍，举办奇石节，意在品茶赏石，以石会友，以石传情，以石养性，预计将有数百枚精美奇石亮相本届奇石节，而来自全国各地的奇石爱好者，也将在7月10日这天，相聚酒城，品美酒，赏奇石。

TAG:中国奇石节7月10日在泸州举行

Every wristwatch buff inside world knows Womens Leather Handbag On Sale

Every wristwatch buff inside world knows that Switzerland is the location where it all started. The Breitling observe provider is no exception. In 1884, Leon Breitling made the decision to consider his desire for quality-crafted precision timepieces towards following level. He founded his provider while using specific motive of producing chronographs and counters for medical applications.

However, his brand grew to become so popular in just several brief years that Breitling was forced to relocate to La Chaux-de-Fonds in 1892, due to enormous growth. This was the Mecca from the observe world, and Leon held on till 1914, when he passed aside and still left his provider inside arms of his daughter Gaston.

The youthful Breitling picks up where his father still left off, and only a brief twelve months later, Breitling introduced their initial chronograph wristwatch. Gaston would carry on for making varied critical advancements as a watchmaker.

He even supplied the initial wristwatch instruments to aviators. Breitling created the initial impartial chronograph push piece in 1923, and in 1934, Gaston’s son, Willy Breitling, took control from the provider and added a second push piece towards traditional watch, enabling cumulative or incremental saving (current configuration). Two years later, Breitling grew to become the official observe dealer from the Royal Air Force. http://www.ywatchesoutlet.com/breitling-replica-watches/breitling-chronomat and http://www.ywatchesoutlet.com/breitling-replica-watches/breitling-superocean

During the 1940s, Breitling went overseas with their timepieces and supplied the usa armed causes with watches. Willy moved the provider in to the long term and developed the “Navitimer,” a wristwatch with an integrated navigation computer in 1954.

This chronograph could be the initial put on by pilots all across the globe. Even astronaut Scott Carpenter wore the Breitling “Cosmonaute” chronograph while in an orbital plane in 1962. The brand continued to work toward even significantly more innovative wrist watches around the following few years, and in 1969, they launched a self-winding chronograph: A extremely outstanding specialized feat that represents an enormous breakthrough, not only inside Swiss observe industry, however the world.

Every wristwatch buff inside world knows Womens Leather Handbag On Sale

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利落银饰成减龄利器

利落银饰成减龄利器

　　比起贵金属黄金、铂金，银饰算不上是什么值钱的金属，但是用白银打造的首饰，很得女人心，也非常适合春夏佩戴。

　十字架项链 Elle 　　马鞍链造型手镯 爱马仕 　　白色几何图案手镯 CK 　　山茶花手镯 Feiliu 　　圆珠戒指 Folli Follie 　　双圆圈镂空耳环 Stroili oro 　　心形吊坠项链Thomas Sabo
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A Guidebook towards the Designs in the Designer Purses Womens Leather Handbag On Sale

In case you are thinking that your favourite designer handbag comes in only 1 fashion, then you definately are incorrect. The purse designers have think of distinctive kinds for that handbags. Everyone provides a unique taste. Keeping this truth in intellect, these handbag designers have devised different models to the purses.

My article guides you a few of the kinds for your purses.
According to 1 European survey, it’s been located that 30-year old gals personal an ordinary of 21 designer purses and purchase a new bag about every 3 months, along with the normal female amassing some 111 purses around her lifetime. Searching at this actuality, the demand for that purses can well be imagined. The different designs for your handbags contain the subsequent:

one. Clutch- This really is a little handbag that will be held in the hand. This style of purses has come from Chinese Laundry and Kenneth Cole also as key designers like Jimmy Choo, Marc Jacobs, D&G and others.
2. Wristlet- This really is usually a small strip that slips around the wrist. It is easy removable. This is usually attached to a clutch or an evening bag.
3. Evening bag- This model in the purse is suitable for the more formal occasions and is made from satin or beaded fabrics.
4. Hobo-This is a typically large, slouchy, crescent-shaped purse including a shoulder strap. This purse is generally made of soft materials that tend to droop while set down.
5. Tote- These are the large, generally square shaped purse with two shoulder straps. The most popular tote styled purses consist of Prada, Christian Dior, and Fendi.
6. Satchel- It is the purse usually larger in size.
7. Cross-body handbags- These handbags are medium in size and feature a long adjustable strap to be worn across the body.

These types on the designer handbags have contributed a lot on the purse industry.

A Guidebook towards the Designs in the Designer Purses Womens Leather Handbag On Sale

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